MCP23S17-E/SP Microchip Technology, MCP23S17-E/SP Datasheet - Page 37

• Manufacturer Part Number: MCP23S17-E/SP
• Description: IC I/O EXPANDER SPI 16B 28SDIP
• Manufacturer: Microchip Technology
• Type: I/O Expanderr

Specifications of MCP23S17-E/SP

• Package / Case: 28-DIP (0.300", 7.62mm)
• Interface: SPI
• Number Of I /o: 16
• Interrupt Output: Yes
• Frequency - Clock: 10MHz
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP23X17EV - BOARD EVAL FOR MCP23X17GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

3.0
3.1
© 2007 Microchip Technology Inc.
28-Lead PDIP (Skinny DIP)
28-Lead SSOP
28-Lead SOIC
28-Lead QFN
PACKAGING INFORMATION
Package Marking Information
XXXXXXXX
XXXXXXXX
YYWWNNN
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
Legend: XX...X
Note:
YYWWNNN
YYWWNNN
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNN
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Y
YY
WW
NNN
*
e
3
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
MCP23017/MCP23S17
Example:
Example:
Example:
Example:
23017
E/ML ^^
0648256
MCP23017-E/SO^^
e
3
MCP23017
0648256
E/SS^^
0648256
MCP23017-E/SP^^
0648256
e
3
e
3
e
3
)
e
3
DS21952B-page 37