MCP23S17-E/SP Microchip Technology, MCP23S17-E/SP Datasheet - Page 45

• Manufacturer Part Number: MCP23S17-E/SP
• Description: IC I/O EXPANDER SPI 16B 28SDIP
• Manufacturer: Microchip Technology
• Type: I/O Expanderr

Specifications of MCP23S17-E/SP

• Package / Case: 28-DIP (0.300", 7.62mm)
• Interface: SPI
• Number Of I /o: 16
• Interrupt Output: Yes
• Frequency - Clock: 10MHz
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP23X17EV - BOARD EVAL FOR MCP23X17GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2007 Microchip Technology Inc.
Device
Temperature
Range
Package
PART NO.
Device
Temperature
–
Range
MCP23017:
MCP23017T:
MCP23S17:
MCP23S17T:
E
ML
SP
SO
SS
X
=
=
=
=
=
-40°C to +125°C (Extended)
Plastic Quad, Flat No Leads (QFN), 28-lead
Plastic DIP (300 mil Body), 28-Lead
Plastic SOIC (300 mil Body), 28-Lead
SSOP, (209 mil Body, 5.30 mm), 28-Lead
Package
/XX
16-Bit I/O Expander w/I
16-Bit I/O Expander w/I
(Tape and Reel)
16-Bit I/O Expander w/SPI Interface
16-Bit I/O Expander w/SPI Interface
(Tape and Reel)
2
2
C™ Interface
C Interface
MCP23017/MCP23S17
Examples:
a)
b)
c)
d)
e)
a)
b)
c)
d)
e)
MCP23017-E/SP:
MCP23017-E/SO: Extended Temp.,
MCP23017T-E/SO: Tape and Reel,
MCP23017-E/SS:
MCP23017T-E/SS: Tape and Reel,
MCP23S17-E/SP: Extended Temp.,
MCP23S17-E/SO: Extended Temp.,
MCP23S17T-E/SO: Tape and Reel,
MCP23S17-E/SS: Extended Temp.,
MCP23S17T-E/SS: Tape and Reel,
.
Extended Temp.,
28LD PDIP package.
28LD SOIC package.
Extended Temp.,
28LD SOIC package.
Extended Temp.,
28LD SSOP package.
Extended Temp.,
28LD SSOP package.
28LD PDIP package.
28LD SOIC package.
Extended Temp.,
28LD SOIC package.
28LD SSOP package.
Extended Temp.,
28LD SSOP package.
DS21952B-page 41