IS82C55AZ Intersil, IS82C55AZ Datasheet - Page 27

• Manufacturer Part Number: IS82C55AZ
• Description: IC I/O EXPANDER 24B 44PLCC
• Manufacturer: Intersil

Specifications of IS82C55AZ

• Interface: Programmable
• Number Of I /o: 24
• Interrupt Output: No
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 44-PLCC
• Chip Configuration: 8 Bit
• Bus Frequency: 8MHz
• No. Of I/o's: 24
• Supply Voltage Range: 4.5V To 5.5V
• Digital Ic Case Style: LCC
• No. Of Pins: 44
• Msl: MSL 3 - 168 Hours
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Frequency - Clock: -

j
E1
x 45
Ceramic Leadless Chip Carrier Packages (CLCC)
B
h x 45
E2
o
-E-
e
-F-
1
A
o
L
0.010
S
L2
E H
S
0.007
D3
D
D1
B1
27
M
-H-
D2
B2
E F
e
S H S
A1
L3
E3
0.010
PLANE 2
PLANE 1
B3
L1
E
S
E F
S
82C55A
J44.A
44 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
NOTES:
SYMBOL
1. Metallized castellations shall be connected to plane 1 terminals
2. Unless otherwise specified, a minimum clearance of 0.015 inch
3. Symbol “N” is the maximum number of terminals. Symbols “ND”
4. The required plane 1 terminals and optional plane 2 terminals (if
5. The corner shape (square, notch, radius, etc.) may vary at the
6. Chip carriers shall be constructed of a minimum of two ceramic
7. Dimension “A” controls the overall package thickness. The maxi-
8. Dimensioning and tolerancing per ANSI Y14.5M-1982.
9. Controlling dimension: INCH.
ND
NE
A1
B1
B2
B3
D1
D2
D3
E1
E2
E3
and extend toward plane 2 across at least two layers of ceramic
or completely across all of the ceramic layers to make electrical
connection with the optional plane 2 terminals.
(0.38mm) shall be maintained between all metallized features
(e.g., lid, castellations, terminals, thermal pads, etc.)
and “NE” are the number of terminals along the sides of length
“D” and “E”, respectively.
used) shall be electrically connected.
manufacturer’s option, from that shown on the drawing.
layers.
e1
L1
L2
L3
mum “A” dimension is package height before being solder dipped.
A
B
D
E
N
e
h
L
j
MIL-STD-1835 CQCC1-N44 (C-5)
0.064
0.054
0.033
0.022
0.006
0.640
0.640
0.015
0.045
0.045
0.075
0.003
MIN
-
-
0.500 BSC
0.250 BSC
0.500 BSC
0.250 BSC
0.050 BSC
0.072 REF
0.040 REF
0.020 REF
INCHES
11
11
44
0.120
0.088
0.039
0.028
0.022
0.662
0.662
0.662
0.662
0.055
0.055
0.095
0.015
MAX
-
16.26
16.26
1.37
0.84
0.56
0.15
1.14
1.14
1.90
0.08
1.63
0.38
MIN
MILLIMETERS
-
-
12.70 BSC
12.70 BSC
1.83 REF
6.35 BSC
6.35 BSC
1.27 BSC
1.02 REF
0.51 REF
11
11
44
16.81
16.81
16.81
16.81
3.05
2.24
0.99
0.71
0.56
1.40
1.40
2.41
0.38
MAX
-
November 16, 2006
Rev. 0 5/18/94
NOTES
FN2969.10
6, 7
2, 4
4
2
2
2
5
5
3
3
3
-
-
-
-
-
-
-
-
-
-
-
-
-
-