293D337X9010E2T Vishay, 293D337X9010E2T Datasheet - Page 12

• Manufacturer Part Number: 293D337X9010E2T
• Description: Tantalum Capacitors - Solid SMD 330uF 10volts 10% E case
• Manufacturer: Vishay
• Series: 293Dr

Specifications of 293D337X9010E2T

• Capacitance: 330 uF
• Voltage Rating: 10 Volts
• Esr: 0.5 Ohms
• Tolerance: 10 %
• Operating Temperature Range: - 55 C to + 85 C
• Package / Case: 7343-43 metric
• Dimensions: 4.3 mm W x 7.3 mm L
• Height: 4 mm
• Mfr Case Code: E Case
• Product: Tantalum Solid Low ESR Commercial Grade
• Dissipation Factor Df: 10
• Lead Spacing: 1.3 mm
• Leakage Current: 33 uAmps
• Ripple Current: 0.57 Amp
• Termination Style: SMD/SMT
• Lead Free Status / Rohs Status: No RoHS Version Available

GUIDE TO APPLICATION
10.
Document Number: 40002
Revision: 25-Apr-05
SOLDERING PROFILE
RECOMMENDED MOUNTING PAD GEOMETRIES in inches [millimeters]
Code
Case
A
B
C
D
E
P
25 ˚C
Recommended Mounting Pad Geometries: Proper mounting pad geometries are essential for successful solder
connections. These dimensions are highly process sensitive and should be designed to minimize component rework due
to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers and may
be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board design.
Recommended SnPb Reflow Soldering Profile
100 ˚C
(Min.)
0.034
[0.87]
0.061
[1.54]
0.061
[1.54]
0.066
[1.68]
0.066
[1.68]
0.034
[0.87]
240 ˚C
150 ˚C
B
A
TIME (seconds)
Wave Solder Pads
183 ˚C
(Nom.)
60 - 90 sec
Pad Dimensions
0.085
[2.15]
0.085
[2.15]
0.106
[2.70]
0.106
[2.70]
0.106
[2.70]
0.085
[2.15]
Preheat
B
All Case Codes
C
D
(Nom.)
(Continued)
0.053
[1.35]
0.065
[1.65]
0.124
[3.15]
0.175
[4.45]
0.175
[4.45]
0.053
[1.35]
TANTAMOUNT®, Commercial, Surface Mount
C
For technical questions, contact: [e-mail]
10 sec
60 sec
Solid Tantalum Chip Capacitors
(Nom.)
0.222
[5.65]
0.234
[5.95]
0.337
[8.55]
0.388
[9.85]
0.388
[9.85]
0.222
[5.65]
E
D
A
(Nom.)
0.048
[1.23]
0.048
[1.23]
0.050
[1.28]
0.050
[1.28]
0.050
[1.28]
0.048
[1.23]
E
Code
Case
25 ˚C
A
B
C
D
E
P
Recommended Pb Free Reflow Soldering Profile
150 ˚C
260 ˚C
200 ˚C
(Min.)
0.071
[1.80]
0.110
[2.80]
0.110
[2.80]
0.118
[3.00]
0.118
[3.00]
0.071
[1.80]
A
B
TIME (seconds)
217 ˚C
Reflow Solder Pads
60 - 150 sec
(Nom.)
Pad Dimensions
0.085
[2.15]
0.085
[2.15]
0.106
[2.70]
0.106
[2.70]
0.106
[2.70]
0.085
[2.15]
Preheat
B
All Case Codes
D
C
(Nom.)
0.053
[1.35]
0.065
[1.65]
0.124
[3.15]
0.175
[4.45]
0.175
[4.45]
0.053
[1.35]
C
Vishay Sprague
10 sec
60 sec
(Nom.)
0.222
[5.65]
0.234
[5.95]
0.337
[8.55]
0.388
[9.85]
0.388
[9.85]
0.222
[5.65]
D
E
www.vishay.com
A
293D
(Nom.)
0.048
[1.23]
0.048
[1.23]
0.050
[1.28]
0.050
[1.28]
0.050
[1.28]
0.048
[1.23]
E
12