MCP23S08-E/P Microchip Technology, MCP23S08-E/P Datasheet - Page 23
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MCP23S08-E/P
Manufacturer Part Number
MCP23S08-E/P
Description
IC I/O EXPANDER SPI 8B 18DIP
Manufacturer
Microchip Technology
Specifications of MCP23S08-E/P
Package / Case
18-DIP (0.300", 7.62mm)
Interface
SPI
Number Of I /o
8
Interrupt Output
Yes
Frequency - Clock
10MHz
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Includes
POR
Logic Family
MCP23S08
Propagation Delay Time
50 ns
Operating Supply Voltage
1.8 V to 5.5 V
Power Dissipation
700 mW
Operating Temperature Range
- 40 C to + 125 C
Input Voltage
1.8 V to 5.5 V
Logic Type
I/O Expander
Maximum Clock Frequency
10 MHz
Maximum Operating Frequency
1.7 MHz
Mounting Style
Through Hole
Output Current
25 mA
Output Voltage
1.8 V to 4.5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
2.0
Absolute Maximum Ratings †
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on V
Voltage on all other pins with respect to V
Total power dissipation (Note) .............................................................................................................................700 mW
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any output pin ....................................................................................................25 mA
Maximum output current sourced by any output pin ...............................................................................................25 mA
© 2007 Microchip Technology Inc.
†
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note:
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
ELECTRICAL CHARACTERISTICS
Power dissipation is calculated as follows:
P
DD
DIS
with respect to V
= V
DD
IK
OK
(V
x {I
DD
SS
I
(V
DD
< 0 or V
pin ..............................................................................................................................125 mA
O
pin ...........................................................................................................................150 mA
- ∑ I
< 0 or V
SS
OH
I
> V
......................................................................................................... -0.3V to +5.5V
} + ∑ {(V
O
DD
> V
SS
)...................................................................................................................... ±20 mA
DD
(except V
DD
) .............................................................................................................. ±20 mA
-V
OH
) x I
DD
)............................................................. -0.6V to (V
OH
} + ∑(V
MCP23008/MCP23S08
OL
x I
OL
)
DS21919E-page 23
DD
+ 0.6V)