MCP23S08-E/P Microchip Technology, MCP23S08-E/P Datasheet - Page 35
![IC I/O EXPANDER SPI 8B 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
MCP23S08-E/P
Manufacturer Part Number
MCP23S08-E/P
Description
IC I/O EXPANDER SPI 8B 18DIP
Manufacturer
Microchip Technology
Specifications of MCP23S08-E/P
Package / Case
18-DIP (0.300", 7.62mm)
Interface
SPI
Number Of I /o
8
Interrupt Output
Yes
Frequency - Clock
10MHz
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Includes
POR
Logic Family
MCP23S08
Propagation Delay Time
50 ns
Operating Supply Voltage
1.8 V to 5.5 V
Power Dissipation
700 mW
Operating Temperature Range
- 40 C to + 125 C
Input Voltage
1.8 V to 5.5 V
Logic Type
I/O Expander
Maximum Clock Frequency
10 MHz
Maximum Operating Frequency
1.7 MHz
Mounting Style
Through Hole
Output Current
25 mA
Output Voltage
1.8 V to 4.5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
© 2007 Microchip Technology Inc.
18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
N
1
2 3
b
D
Dimension Limits
e
E1
A2
E
Units
A2
A1
E1
L1
D
N
A
E
e
h
L
c
b
MCP23008/MCP23S08
MIN
2.05
0.10
0.25
0.40
0.20
0.31
L
0°
5°
5°
–
h
L1
MILLIMETERS
10.30 BSC
11.55 BSC
1.27 BSC
7.50 BSC
1.40 REF
NOM
18
h
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-051B
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
8°
–
DS21919E-page 35
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