MCP23S18-E/MJ Microchip Technology, MCP23S18-E/MJ Datasheet - Page 33

• Manufacturer Part Number: MCP23S18-E/MJ
• Description: IC I/O EXPANDER SPI 16B 24QFN
• Manufacturer: Microchip Technology

Specifications of MCP23S18-E/MJ

• Package / Case: 24-QFN
• Interface: SPI
• Number Of I /o: 16
• Interrupt Output: Yes
• Frequency - Clock: 10MHz
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Logic Family: Interface ICs
• Propagation Delay Time: 50 ns
• Operating Supply Voltage: 1.8 V to 5.5 V
• Power Dissipation: 700 mW
• Operating Temperature Range: - 40 C to + 125 C
• Input Voltage: 1.8 V to 5.5 V
• Logic Type: I/O Expander
• Maximum Clock Frequency: 10 MHz
• Maximum Operating Frequency: 3.4 MHz
• Mounting Style: SMD/SMT
• Output Current: 400 mA
• Output Voltage: 0.6 V to 4.8 V
• Package: 24QFN EP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

2.0
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on V
Voltage on RESET with respect to V
Voltage on all other pins with respect to V
Voltage on GPIO Pins: ................................................................................................................................. -0.6V to 5.5V
Total power dissipation (Note 1)...........................................................................................................................700 mW
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any Output pin....................................................................................................25 mA
Maximum output current sunk by any Output pin (V
Maximum output current sourced by any Output pin ..............................................................................................25 mA
Maximum output current sourced by any Output pin (V
© 2008 Microchip Technology Inc.
†
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note:
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
ELECTRICAL CHARACTERISTICS
Power dissipation is calculated as follows:
Pdis = V
DD
with respect to V
DD
IK
OK
(V
x {I
DD
SS
I
(V
DD
< 0 or V
pin ..............................................................................................................................125 mA
O
pin ...........................................................................................................................400 mA
- ∑ I
< 0 or V
SS
OH
I
> V
......................................................................................................... -0.3V to +7.0V
SS
} + ∑ {(V
(†)
O
..................................................................................................... -0.3V to +14V
DD
> V
SS
)...................................................................................................................... ±20 mA
DD
(except V
DD
) .............................................................................................................. ±20 mA
-V
OH
DD
) x I
DD
= 1.8V) ..............................................................................10 mA
DD
and GPIOA/B) ...................................... -0.6V to (V
OH
= 1.8V).........................................................................10 mA
} + ∑(V
MCP23018/MCP23S18
OL
x I
OL
)
DS22103A-page 33
DD
+ 0.6V)