PCA8574D,518 NXP Semiconductors, PCA8574D,518 Datasheet - Page 22

IC I/O EXPANDER I2C 8B 16SOIC

PCA8574D,518

Manufacturer Part Number
PCA8574D,518
Description
IC I/O EXPANDER I2C 8B 16SOIC
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCA8574D,518

Interface
I²C
Number Of I /o
8
Interrupt Output
Yes
Frequency - Clock
400kHz
Voltage - Supply
2.3 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.300", 7.5mm Width)
Includes
POR
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935283485518
PCA8574D-T
PCA8574D-T
NXP Semiconductors
PCA8574_PCA8574A_2
Product data sheet
Table 9.
Table 10.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
Fig 22. Temperature profiles for large and small components
2.5
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9
MSL: Moisture Sensitivity Level
temperature
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
10
22.
Rev. 02 — 14 May 2007
= minimum soldering temperature
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Remote 8-bit I/O expander for I
3
3
)
)
350 to 2000
260
250
245
220
220
PCA8574/74A
350
temperature
peak
2
C-bus with interrupt
> 2000
260
245
245
© NXP B.V. 2007. All rights reserved.
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