PCA9554D,118 NXP Semiconductors, PCA9554D,118 Datasheet - Page 29

• Manufacturer Part Number: PCA9554D,118
• Description: IC I/O EXPANDER I2C 8B 16SOIC
• Manufacturer: NXP Semiconductors

Specifications of PCA9554D,118

• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Interface: I²C, SMBus
• Number Of I /o: 8
• Interrupt Output: Yes
• Frequency - Clock: 400kHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Includes: POR
• Logic Family: PCA9554
• Number Of Lines (input / Output): 8.0 / 8.0
• Operating Supply Voltage: 2.3 V to 5.5 V
• Power Dissipation: 200 mW
• Operating Temperature Range: - 40 C to + 85 C
• Input Voltage: 5 V
• Logic Type: I2C, SMBus
• Maximum Clock Frequency: 400 KHz
• Mounting Style: SMD/SMT
• Number Of Input Lines: 8.0
• Number Of Output Lines: 8.0
• Output Current: 50 mA
• Output Voltage: 5 V
• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Package Type: SO
• Rad Hardened: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935269192118; PCA9554D-T; PCA9554D-T

NXP Semiconductors
PCA9555_8
Product data sheet
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 16.
Table 17.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
2.5
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 16
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
17
32.
Rev. 08 — 22 October 2009
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
16-bit I
3
3
)
)
Figure
2
C-bus and SMBus I/O port with interrupt
350 to 2000
260
250
245
32) than a SnPb process, thus
220
220
350
> 2000
260
245
245
PCA9555
© NXP B.V. 2009. All rights reserved.
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