PCF8575TS/1,118 NXP Semiconductors, PCF8575TS/1,118 Datasheet - Page 19

• Manufacturer Part Number: PCF8575TS/1,118
• Description: IC I/O EXPANDER I2C 16B 24SSOP
• Manufacturer: NXP Semiconductors

Specifications of PCF8575TS/1,118

• Package / Case: 24-SSOP
• Interface: I²C
• Number Of I /o: 16
• Interrupt Output: Yes
• Frequency - Clock: 400kHz
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Includes: POR
• Logic Family: PCF8575
• Operating Supply Voltage: 2.5 V to 5.5 V
• Power Dissipation: 400 mW
• Operating Temperature Range: - 40 C to + 85 C
• Logic Type: I/O Expander
• Maximum Clock Frequency: 400 KHz
• Mounting Style: SMD/SMT
• Output Current: 25 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-1079-2; 935276552118; PCF8575TSDB-T

Philips Semiconductors
14.5
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
1999 Apr 07
HLQFP, HSQFP, HSOP, SMS
PLCC
LQFP, QFP, TQFP
SQFP
SSOP, TSSOP, VSO
Remote 16-bit I/O expander for I
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
Suitability of surface mount IC packages for wave and reflow soldering methods
, SO
PACKAGE
not suitable
suitable
not recommended
not suitable
not recommended
2
(2)
C-bus
WAVE
19
(3)(4)
(5)
SOLDERING METHOD
suitable
suitable
suitable
suitable
suitable
REFLOW
Product specification
PCF8575
(1)