NUR460,133 NXP Semiconductors, NUR460,133 Datasheet
NUR460,133
Specifications of NUR460,133
Related parts for NUR460,133
NUR460,133 Summary of contents
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... Assembly Operations PL Bipolar NXP Semiconductors Self Qualification Report NUR460/SOD141 Package qualification in subcontractor GoodArk Date: 2011-05-20 Self Qualification Report: NUR460/SOD141 package releasing in subcontractor GoodArk (Qual Plan ref. 1410 ) Author: Brian Xie Document Number 1410 NXP Semiconductors Assembly Operations-PL Bipolar Page: 1 Revision: 01 ...
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... Assembly Operations PL Bipolar NXP Semiconductors Table of Contents 1. Introduction .................................................................................................................................................. 3 2. Material details ............................................................................................................................................. 3 3. Constructional Details of Test vehicles ....................................................................................................... 4 3.1 Test vehicles ............................................................................................................................................ 4 3.2 Package structure ........................................................................................................................4 4. Reliability Test Program .............................................................................................................................. 5 4.1 Reliability Test Descriptions ................................................................................................................... 5 4.2 Construction Analysis Tests Descriptions ............................................................................................... 5 5. Self-qualification results. ............................................................................................................................. 6 6. Marking ....................................................................................................................................................... 10 7. ...
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... Assembly Operations PL Bipolar NXP Semiconductors 1. Introduction This qualification report is to release SOD141 package which will be used for product NUR460. The NUR460 process flow is designed to give a 300um thick epi diode with solderable front metal suitable for assembly in DO-201A(SOD141) package at GoodArk sub-contractor. This is a new process flow for DJLN but solderable front metal has been used on devices manufactured at the Manchester bipolar waferfab some years earlier ...
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... Assembly Operations PL Bipolar NXP Semiconductors 3. Constructional Details of Test vehicles 3.1 Test vehicles Trail 2: Jan 17,2011 Trail No. Test Lot F3C8874W3-1 F3C8874W3-2 Overall 96.05% yield Product NUR460 Assembly GoodArk GoodArk site 3.2 Package structure: Date: 2011-05-20 Self Qualification Report: NUR460/SOD141 package releasing in subcontractor GoodArk F3C8875W7 96 ...
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... Assembly Operations PL Bipolar NXP Semiconductors 4. Reliability Test Program The reliability qualification test matrix can be found in Section 5. In this section the reliability tests are described in detail. These tests are stated in NXP Semiconductors Quality and Reliability Specification (NX2-00001) 4.1 Reliability Test Descriptions 1000 hours – max operating temp, Reverse Bias = 80% rated voltage. ...
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... Assembly Operations PL Bipolar NXP Semiconductors 5. Self-qualification results. Numbers in format number of failures, y=sample size tested 5.1 High Temperature, Humidity & Reverse Bias (THBS) 1000 hours 85 85%, Reverse Bias = 80% rated voltage Test before, at 168, 500 &1000 hours. Package Product SOD141 NUR460 SOD141 NUR460 ...
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... Assembly Operations PL Bipolar NXP Semiconductors 5.5 Thermal Fatigue (TFAT) 10000 cycles, Tj =100º 3.2A, Ton=80sec Toff=140sec Test before, at 5000 cycles & 10000 cycles Package Product SOD141 NUR460 SOD141 NUR460 SOD141 NUR460 5.6 High Temperature Storage (HTSL) 1000 hours 150° C Test before, at 168, 500 hours & 1000 hours. ...
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... Assembly Operations PL Bipolar NXP Semiconductors F3C8874-1 Lead Body Body No. Length Length Diameter( (mm) (mm) mm) MAX 26.33 9.180 5.190 MIN 26.30 9.100 5.130 AVG 26.31 9.130 5.161 5.8 Final test yield summary Test Lot TT10490009Y F3C8874W3-1 Test yield 5.9 Mechanical test: 5.9.1 Solderability, ESD & teminal strength test ...
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... Assembly Operations PL Bipolar NXP Semiconductors Test Test Reference ESD Characterization JESD22-A114E Human Body Model ESD Characterization JESD22-A115A Machine Model Terminal Strength MIL-STD-750 Method 2036 Resistance to Solder JESD22 B-106 Heat Solderability JESD22 B-102 Solderability with Aging JESD22 B-102 16 hour dry bake Soderability with Aging ...
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... Assembly Operations PL Bipolar NXP Semiconductors 7. Conclusions According to the assembly trail and life test result, the SOD141 package can meet all the requirement of product NUR460, and is ready to release. And GoodArk had also proved that it has enough capability for this package and product production. ...