NTMFS5832NLT1G ON Semiconductor, NTMFS5832NLT1G Datasheet

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NTMFS5832NLT1G

Manufacturer Part Number
NTMFS5832NLT1G
Description
MOSFET N-CH 40V 110A SO8 FL
Manufacturer
ON Semiconductor
Series
-r
Datasheet

Specifications of NTMFS5832NLT1G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
4.2 mOhm @ 20A, 10V
Drain To Source Voltage (vdss)
40V
Current - Continuous Drain (id) @ 25° C
20A
Vgs(th) (max) @ Id
3V @ 250µA
Gate Charge (qg) @ Vgs
51nC @ 10V
Input Capacitance (ciss) @ Vds
2700pF @ 25V
Power - Max
3.1W
Mounting Type
*
Package / Case
*
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTMFS5832NLT1G
Manufacturer:
AD
Quantity:
101
Part Number:
NTMFS5832NLT1G
Manufacturer:
ON/安森美
Quantity:
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Part Number:
NTMFS5832NLT1G
0
NTMFS5832NL
Power MOSFET
40 V, 111 A, 4.2 mW
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 sq−in pad
2. Surface−mounted on FR4 board using 0.155 in sq (100mm
© Semiconductor Components Industries, LLC, 2011
May, 2011 − Rev. 0
MAXIMUM RATINGS
THERMAL RESISTANCE MAXIMUM RATINGS
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current R
(Note 1)
Power Dissipation
R
Continuous Drain
Current R
(Note 1)
Power Dissipation
R
Pulsed Drain
Current
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy (L = 0.1 mH)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
Junction−to−Case (Drain) (Note 1)
Junction−to−Ambient Steady State
(Note 1)
Junction−to−Ambient Steady State
(Note 2)
Compliant
Low R
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
(Cu area = 1.127 in sq [2 oz] inclusing traces).
qJA
qJC
(Note 1)
(Note 1)
DS(on)
qJA
qJC
to Minimize Conduction Losses
Parameter
Parameter
Steady
State
(T
J
= 25°C unless otherwise stated)
t
p
= 10 ms
T
T
T
T
T
T
T
T
A
A
A
A
C
C
C
C
= 25°C
= 70°C
= 25°C
= 70°C
= 25°C
= 70°C
= 25°C
= 70°C
Symbol
T
Symbol
R
R
R
J
V
EAS
V
, T
IAS
I
qJC
qJA
qJA
P
P
DSS
DM
T
I
I
I
GS
D
D
S
D
D
L
STG
Value
2
−55 to
Value
1.3
+150
40
75
) pad size.
±20
443
134
260
111
111
3.1
1.9
40
20
16
89
96
61
52
1
°C/W
Unit
Unit
mJ
°C
°C
W
W
V
V
A
A
A
A
A
†For information on tape and reel specifications,
NTMFS5832NLT1G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
V
(BR)DSS
40 V
A
Y
WW
G
(Note: Microdot may be in either location)
CASE 488AA
Device
(SO−8FL)
STYLE 1
G (4)
DFN5
ORDERING INFORMATION
N−CHANNEL MOSFET
= Assembly Location
= Year
= Work Week
= Pb−Free Package
1
http://onsemi.com
6.5 mW @ 4.5 V
4.2 mW @ 10 V
R
D (5)
DS(ON)
(Pb−Free)
Package
DFN5
Publication Order Number:
MAX
S (1,2,3)
S
S
S
G
MARKING
DIAGRAM
1500/Tape & Reel
NTMFS5832NL/D
AYWWG
Shipping
5832
D
D
G
I
D
111 A
MAX
D
D

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NTMFS5832NLT1G Summary of contents

Page 1

... WW G (Note: Microdot may be in either location) Symbol Value Unit R 1.3 qJC 40 R NTMFS5832NLT1G qJA °C/W †For information on tape and reel specifications qJA including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/ pad size. ...

Page 2

ELECTRICAL CHARACTERISTICS Parameter OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage Drain−to−Source Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate−to−Source Leakage Current ON CHARACTERISTICS (Note 3) Gate Threshold Voltage Negative Threshold Temperature Coefficient Drain−to−Source On Resistance Forward Transconductance CHARGES, CAPACITANCES & ...

Page 3

V 5.0 V 200 150 100 DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 1. On−Region Characteristics 0.020 0.015 0.010 0.005 0.000 GATE−TO−SOURCE VOLTAGE (V) ...

Page 4

C iss 3000 2500 2000 1500 1000 C oss 500 C rss DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 7. Capacitance Variation 1000 ...

Page 5

Duty Cycle = 0.5 10 0.2 0.1 0.05 1 0.02 0.01 0.1 Single Pulse 0.01 0.000001 0.00001 0.0001 TYPICAL CHARACTERISTICS 0.001 0.01 0.1 PULSE TIME (sec) Figure 13. Thermal Response http://onsemi.com 100 1000 ...

Page 6

... M 3.200 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81− ...

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