TDA5051AT/C1,518 NXP Semiconductors, TDA5051AT/C1,518 Datasheet - Page 24

• Manufacturer Part Number: TDA5051AT/C1,518
• Description: IC HOME AUTOMATION MODEM 16SOIC
• Manufacturer: NXP Semiconductors

Specifications of TDA5051AT/C1,518

• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Data Format: ASK over Home Power Lines
• Baud Rates: 1.2k
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Interface: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935234750518; TDA5051ATD-T; TDA5051ATD-T

NXP Semiconductors
TDA5051A
Product data sheet
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 9.
Table 10.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
All information provided in this document is subject to legal disclaimers.
10
25.
Rev. 5 — 13 January 2011
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
25) than a SnPb process, thus
220
≥ 350
220
Home automation modem
TDA5051A
> 2000
260
245
245
© NXP B.V. 2011. All rights reserved.
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