P82B96TD/S900,118 NXP Semiconductors, P82B96TD/S900,118 Datasheet - Page 24

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P82B96TD/S900,118

Manufacturer Part Number
P82B96TD/S900,118
Description
IC INTERFACE
Manufacturer
NXP Semiconductors
Type
Bufferr
Datasheet

Specifications of P82B96TD/S900,118

Tx/rx Type
I²C Logic
Delay Time
5.0ns
Capacitance - Input
7pF
Voltage - Supply
2 V ~ 15 V
Current - Supply
900µA
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-5123-2
NXP Semiconductors
Fig 26. Package outline SOT96-1 (SO8)
P82B96_8
Product data sheet
SO8: plastic small outline package; 8 leads; body width 3.9 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT96-1
0.069
max.
1.75
A
0.010
0.004
0.25
0.10
A
1
0.057
0.049
1.45
1.25
A
076E03
2
IEC
1
8
Z
pin 1 index
0.25
0.01
A
y
3
e
0.019
0.014
0.49
0.36
b
p
D
0.0100
0.0075
0.25
0.19
MS-012
JEDEC
c
b
REFERENCES
Rev. 08 — 10 November 2009
0.20
0.19
p
D
5.0
4.8
5
4
0
(1)
w
0.16
0.15
E
4.0
3.8
(2)
M
JEITA
scale
1.27
0.05
2.5
c
e
A
0.244
0.228
2
H
6.2
5.8
A
E
1
0.041
1.05
5 mm
L
H
0.039
0.016
E
E
1.0
0.4
detail X
L
p
0.028
0.024
L
L
0.7
0.6
Q
p
Q
PROJECTION
(A )
EUROPEAN
Dual bidirectional bus buffer
0.25
0.01
3
A
v
0.25
0.01
A
w
v
X
M
0.004
A
0.1
© NXP B.V. 2009. All rights reserved.
y
P82B96
ISSUE DATE
99-12-27
03-02-18
0.028
0.012
Z
0.7
0.3
(1)
SOT96-1
8
0
o
o
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