NCP382LMN10AATXG ON Semiconductor, NCP382LMN10AATXG Datasheet - Page 11

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NCP382LMN10AATXG

Manufacturer Part Number
NCP382LMN10AATXG
Description
IC DISTR LOAD SWITCH 2CH 8DFN
Manufacturer
ON Semiconductor
Datasheets

Specifications of NCP382LMN10AATXG

Lead Free Status / Rohs Status
Compliant
REFERENCE
2X
NOTE 4
2X
PIN ONE
0.10 C
0.05 C
0.05 C
8X
8X
DETAIL A
L
0.10 C
K
e/2
É É É
É É É
É É É
e
BOTTOM VIEW
1
8
SIDE VIEW
TOP VIEW
D2
D
DETAIL B
4
5
A1
8X
E2
A
E
B
(A3)
b
0.10
0.05
C
C
A
C
NOTE 3
A
PACKAGE DIMENSIONS
SEATING
PLANE
L1
B
EXPOSED Cu
http://onsemi.com
DFN8, 3x3, 0.65P
CASE 506BW−01
CONSTRUCTIONS
CONSTRUCTIONS
ISSUE O
DETAIL B
É É É É
É É
DETAIL A
OPTIONAL
OPTIONAL
11
L
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MOLD CMPD
1.75
PITCH
L
0.65
SOLDERING FOOTPRINT*
Ç Ç
Ç Ç
Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç
1
RECOMMENDED
NOTES:
Ç
Ç
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
2.50
ASME Y14.5M, 1994.
AND IS MEASURED BETWEEN 0.15 AND
0.30mm FROM THE TERMINAL TIP.
PAD AS WELL AS THE TERMINALS.
DIM
A1
A3
D2
E2
L1
A
D
E
K
b
e
L
Ç Ç
Ç Ç
DIMENSIONS: MILLIMETERS
MILLIMETERS
MIN
0.80
0.00
0.25
2.30
1.55
0.20
0.35
0.00
Ç Ç
Ç Ç
0.20 REF
3.00 BSC
3.00 BSC
0.65 BSC
MAX
1.00
0.05
0.35
2.50
1.75
0.45
0.15
−−−
0.40
8X
8X
0.62
3.30

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