NCP382LMN10AATXG ON Semiconductor, NCP382LMN10AATXG Datasheet - Page 3

• Manufacturer Part Number: NCP382LMN10AATXG
• Description: IC DISTR LOAD SWITCH 2CH 8DFN
• Manufacturer: ON Semiconductor

Specifications of NCP382LMN10AATXG

• Lead Free Status / Rohs Status: Compliant

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. According to JEDEC standard JESD22−A108.
2. This device series contains ESD protection and passes the following tests:
3. Latch up Current Maximum Rating: $100 mA per JEDEC standard: JESD78 class II.
4. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.
6. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
7. The R
8. The maximum power dissipation (P
Human Body Model (HBM) ESD Rating are (Note 2)
Machine Model (MM) ESD Rating are (Note 2)
Latch−up protection (Note 3)
MAXIMUM RATINGS
OPERATING CONDITIONS
Symbol
From IN to OUT1, From IN to OUT2 Supply Voltage (Note 1)
IN, OUT1,OUT2, EN1, EN2, FLAG1, FLAG2 (Note 1)
FLAG1, FLAG2 sink current
ESD Withstand Voltage (IEC 61000−4−2) (output only, when
bypassed with 1.0 mF capacitor minimum)
Maximum Junction Temperature (Note 4)
Storage Temperature Range
Moisture Sensitivity (Note 5)
C
I
V
Human Body Model (HBM) +/−2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) +/−200 V per JEDEC standard: JESD22−A115 for all pins.
I
final PCB layout.
R
OUTX
SINK
V
C
OUTX
P
ENX
T
T
qJA
IN
IN
A
D
J
qJA
− Pins IN, OUT1, OUT2, FLAG1, FLAG2
− EN1, EN2
is dependent of the PCB heat dissipation. Announced thermal resistance is the unless PCB dissipation and can be improve with
Operational Power Supply
Enable Voltage
Ambient Temperature Range
FLAG sink current
Decoupling input capacitor
Decoupling output capacitor
Thermal Resistance Junction−to−Air
Junction Temperature Range
Recommended Maximum DC
current
Power Dissipation Rating (Note 8)
Parameter
Rating
D
) is given by the following formula:
T
T
A
A
v 25°C
http://onsemi.com
= 85°C
SOIC−8 package (Notes 6 and 7)
DFN−8 package (Notes 6 and 7)
V
USB port per Hub
SOIC−8 package
3
IN,
DFN−8 package
Conditions
V
OUT1,
V
P
V
IN ,
SOIC−8 package
SOIC−8 package
D
FLAG1
DFN−8 package
DFN−8 package
ESD HBM
+
ESD IEC
ESD MM
V
Symbol
V
OUT1
T
I
MSL
OUT2,
SINK
LU
T
STG
T
, V
J
JMAX
,V
FLAG2
R
V
OUT2
qJA
EN1,
* T
V
A
EN2,
Min
−40
120
−40
850
570
428
285
2.5
0
1
15 Air, 8 contact
−40 to + TSD
−40 to + 150
−7.0 to +7.0
−0.3 to +7.0
Level 1
Value
Typ
140
210
2000
25
25
200
100
1.0
+125
Max
+85
5.5
5.5
1.5
1
2
°C/W
°C/W
Unit
Unit
mW
mW
mW
mW
mA
mA
mA
kV
°C
°C
°C
mF
mF
°C
V
V
V
V
V
A
A