UJA1065TW/3V3:512 NXP Semiconductors, UJA1065TW/3V3:512 Datasheet - Page 71
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UJA1065TW/3V3:512
Manufacturer Part Number
UJA1065TW/3V3:512
Description
IC CAN/LIN FAIL-SAFE HS 32HTSSOP
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1065TW3V3CT.pdf
(76 pages)
Specifications of UJA1065TW/3V3:512
Applications
*
Interface
*
Voltage - Supply
*
Package / Case
32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935288867512
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NXP Semiconductors
UJA1065_7
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Fig 30. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Rev. 07 — 25 February 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
High-speed CAN/LIN fail-safe system basis chip
temperature
peak
UJA1065
© NXP B.V. 2010. All rights reserved.
001aac844
time
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