UJA1065TW/3V3:512 NXP Semiconductors, UJA1065TW/3V3:512 Datasheet - Page 76

• Manufacturer Part Number: UJA1065TW/3V3:512
• Description: IC CAN/LIN FAIL-SAFE HS 32HTSSOP
• Manufacturer: NXP Semiconductors

Specifications of UJA1065TW/3V3:512

• Applications: *
• Interface: *
• Voltage - Supply: *
• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935288867512

NXP Semiconductors
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13
13.1
13.2
13.3
13.4
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15
15.1
15.2
15.3
15.4
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17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 68
Soldering of SMD packages . . . . . . . . . . . . . . 69
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 72
Legal information. . . . . . . . . . . . . . . . . . . . . . . 73
Contact information. . . . . . . . . . . . . . . . . . . . . 74
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Wave and reflow soldering . . . . . . . . . . . . . . . 69
Introduction to soldering . . . . . . . . . . . . . . . . . 69
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 69
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 70
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 73
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
High-speed CAN/LIN fail-safe system basis chip
Date of release: 25 February 2010
Document identifier: UJA1065_7
UJA1065
All rights reserved.