MCZ33889DEGR2 Freescale Semiconductor, MCZ33889DEGR2 Datasheet - Page 57

• Manufacturer Part Number: MCZ33889DEGR2
• Description: IC SYSTEM BASIS W/CAN 28-SOIC
• Manufacturer: Freescale Semiconductor

Specifications of MCZ33889DEGR2

• Applications: *
• Interface: *
• Voltage - Supply: *
• Package / Case: 28-SOIC (7.5mm Width)
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Device on Thermal Test Board
Analog Integrated Circuit Device Data
Freescale Semiconductor
Material:
Outline:
Area A:
Ambient Conditions:
V2CTRL
VDD1
VSUP
GND
GND
GND
GND
RST
HS1
INT
RX
TX
L0
L1
18.0 mm x 7.5 mm Body
33889 Pin Connections
28-Pin SOICW
1.27 mm Pitch
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100 mm board area,
including edge connector for thermal
testing
Cu heat-spreading areas on board
surface
Natural convection, still air
28
27
26
25
24
23
22
21
20
19
18
17
16
15
WDOG
CS
MOSI
MISO
SCLK
GND
GND
GND
GND
CANL
CANH
RTL
RTH
V2
Figure 24. Thermal Test Board
A
Table 35. Thermal Resistance Performance
ambient air.
R
θJA
Resistance
Thermal
R
is the thermal resistance between die junction and
θ
JA
Area A (mm
THERMAL ADDENDUM (REV 2.0)
300
600
ADDITIONAL DOCUMENTATION
0
2
)
(°C/W)
69
53
48
33889
57