MT41J512M4HX-125:D Micron Technology Inc, MT41J512M4HX-125:D Datasheet - Page 159
MT41J512M4HX-125:D
Manufacturer Part Number
MT41J512M4HX-125:D
Description
IC DDR3 SDRAM 2GBIT 78FBGA
Manufacturer
Micron Technology Inc
Series
-r
Datasheet
1.MT41J256M8JE-187EA.pdf
(181 pages)
Specifications of MT41J512M4HX-125:D
Format - Memory
RAM
Memory Type
DDR3 SDRAM
Memory Size
2G (512M x 4)
Speed
800MHz
Interface
Parallel
Voltage - Supply
1.425 V ~ 1.575 V
Operating Temperature
0°C ~ 95°C
Package / Case
78-TFBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT41J512M4HX-125:D
Manufacturer:
Micron Technology Inc
Quantity:
10 000
- Current page: 159 of 181
- Download datasheet (9Mb)
Figure 104: MRS Command to Power-Down Entry
Figure 105: Power-Down Exit to Refresh to Power-Down Entry
RESET
PDF: 09005aef826aaadc/Source: 09005aef82a357c3
DDR3_D4.fm - Rev G 2/09 EN
Command
Command
Address
CK#
CKE
CKE
CK
CK#
CK
NOP
T0
Valid
MRS
T0
Notes:
t CK
t CK
Enter power-down
t IS
mode
1.
2.
The RESET signal (RESET#) is an asynchronous signal that triggers any time it drops
LOW, and there are no restrictions about when it can go LOW. After RESET# goes LOW, it
must remain LOW for 100ns. During this time, the outputs are disabled, ODT (R
off (High-Z), and the DRAM resets itself. CKE should be brought LOW prior to RESET#
being driven HIGH. After RESET# goes HIGH, the DRAM must be reinitialized as though
a normal power up were executed (see Figure 106 on page 160). All refresh counters on
the DRAM are reset, and data stored in the DRAM is assumed unknown after RESET# has
gone LOW.
NOP
NOP
T1
T1
t
t
next power-down can be entered.
t CH
XP must be satisfied before issuing the command.
XPDLL must be satisfied (referenced to the registration of power-down exit) before the
t CH
t CPDED
t CL
t CL
t MRSPDEN
NOP
NOP
T2
T2
t PD
NOP
T3
Ta0
t IH
159
Exit power-down
t IS
t IS
Micron Technology, Inc., reserves the right to change products or specifications without notice.
mode
NOP
NOP
Ta1
T4
t CPDED
t XP 1
2Gb: x4, x8, x16 DDR3 SDRAM
REFRESH
NOP
Ta2
Ta0
t XPDLL 2
Indicates a Break in
Time Scale
Indicates a Break in
Time Scale
©2006 Micron Technology, Inc. All rights reserved.
t PD
Ta3
NOP
Ta1
Operations
Enter power-down
TT
Don’t Care
Ta4
mode
NOP
Don’t Care
Tb0
) turns
Related parts for MT41J512M4HX-125:D
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
IC SDRAM 64MBIT 133MHZ 54TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 64MBIT 5.5NS 86TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 64MBIT 200MHZ 86TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 64MBIT 133MHZ 54TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 128MBIT 133MHZ 54TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 256MBIT 133MHZ 90VFBGA
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 128MBIT 133MHZ 54TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 256MBIT 133MHZ 54TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC DDR SDRAM 512MBIT 6NS 66TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 128MBIT 167MHZ 86TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 128MBIT 143MHZ 86TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
SDRAM 256M-BIT 1.8V 54-PIN VFBGA
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 128MBIT 143MHZ 86TSOP
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 128MBIT 125MHZ 54VFBGA
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC SDRAM 128MBIT 125MHZ 54VFBGA
Manufacturer:
Micron Technology Inc
Datasheet: