MT36HTF51272FDZ-80EH1N8 Micron Technology Inc, MT36HTF51272FDZ-80EH1N8 Datasheet

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MT36HTF51272FDZ-80EH1N8

Manufacturer Part Number
MT36HTF51272FDZ-80EH1N8
Description
MODULE DDR2 SDRAM 4GB 240FDIMM
Manufacturer
Micron Technology Inc
Series
-r
Datasheet

Specifications of MT36HTF51272FDZ-80EH1N8

Memory Type
DDR2 SDRAM
Memory Size
4GB
Speed
800MT/s
Features
-
Package / Case
240-FBDIMM
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
DDR2 SDRAM FBDIMM
MT36HTF51272FDZ – 4GB
Features
• 240-pin, DDR2 fully buffered DIMM (FBDIMM)
• Fast data transfer rates: PC2-4200, PC2-5300, or
• 4GB (512 Meg x 72)
• 3.2 Gb/s, 4 Gb/s, and 4.8 Gb/s link transfer rates
• High-speed, 1.5V differential, point-to-point link be-
• Fault-tolerant; can work around a bad bit lane in
• High-density scaling with up to eight FBDIMM devi-
• SMBus interface to AMB for configuration register
• In-band and out-of-band command access
• Deterministic protocol
• Automatic DDR2 SDRAM bus and channel calibra-
• Transmitter de-emphasis to reduce ISI
Table 1: Key Timing Parameters
PDF: 09005aef8409299f
htf36c512x72fdz.pdf - Rev. A 06/10 EN
PC2-6400
tween host memory controller and the advanced
memory buffer (AMB)
each direction
ces per channel
access
tion
Speed
Grade
-80E
-667
-53E
– Enables memory controller to optimize DRAM
– Delivers precise control and repeatable memo-
accesses for maximum performance
ry behavior
Products and specifications discussed herein are subject to change by Micron without notice.
Nomenclature
Industry
PC2-6400
PC2-5300
PC2-4200
CL = 6
800
CL = 5
Data Rate (MT/s)
800
667
4GB (x72, QR) 240-Pin DDR2 SDRAM FBDIMM
1
Figure 1: 240-Pin FBDIMM (MO-256)
Module height: 30.35mm (1.19in)
Features (Continued)
• MBIST and IBIST test functions
• Transparent mode for DRAM test support
• V
• V
• V
• V
• Serial presence-detect (SPD) with EEPROM
• Gold edge contacts
• Quad rank
• Supports 95°C operation with 2X refresh
CL = 4
Options
• Package
• Frequency/CAS latency
533
553
553
tion
– 240-pin DIMM (halogen-free)
– 2.5ns @ CL = 5 (DDR2-800)
– 3.0ns @ CL = 5 (DDR2-667)
DD
REF
CC
DDSPD
Micron Technology, Inc. reserves the right to change products or specifications without notice.
= 1.5V for AMB
= V
= 0.9V SDRAM command and address termina-
DDQ
= 3–3.6V for AMB and EEPROM
CL = 3
400
400
400
= 1.8V for DRAM
t
(ns)
12.5
RCD
15
15
© 2010 Micron Technology, Inc. All rights reserved.
(ns)
12.5
t
15
15
RP
Marking
Features
-80E
-667
Z
(ns)
t
55
55
55
RC

Related parts for MT36HTF51272FDZ-80EH1N8

MT36HTF51272FDZ-80EH1N8 Summary of contents

Page 1

... DDR2 SDRAM FBDIMM MT36HTF51272FDZ – 4GB Features • 240-pin, DDR2 fully buffered DIMM (FBDIMM) • Fast data transfer rates: PC2-4200, PC2-5300, or PC2-6400 • 4GB (512 Meg x 72) • 3.2 Gb/s, 4 Gb/s, and 4.8 Gb/s link transfer rates • High-speed, 1.5V differential, point-to-point link be- ...

Page 2

... The data sheet for the base device can be found on Micron’s Web site. Notes: 2. All part numbers end with a four-place code (not shown) that designates component, PCB, and AMB revi- sions. Consult factory for current revision codes. Example: MT36HTF51272FDZ-80EH1N8. PDF: 09005aef8409299f htf36c512x72fdz.pdf - Rev. A 06/10 EN ...

Page 3

Pin Assignments and Descriptions Table 4: Pin Assignments 240-Pin FBDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol PN3 PN3 ...

Page 4

Table 5: Pin Descriptions Symbol Type Description PS[9:0] Input Primary southbound data, positive lines. PS#[9:0] Input Primary southbound data, negative lines. SCK Input System clock input, positive line. SCK# Input System clock input, negative line. SCL Input Serial presence-detect (SPD) ...

Page 5

... System Block Diagram Commodity DDR2 DDR2 SDRAM component devices DDR2 component DDR2 component DDR2 component modules AMB • • • DDR2 component DDR2 component DDR2 component DDR2 component SMBus access to buffer registers Micron Technology, Inc. reserves the right to change products or specifications without notice. ...

Page 6

Functional Block Diagram Figure 3: Functional Block Diagram RS0# RS2# RS1# RS3# DQS0 DQS0# DM0 DM CS# DQS DQS# DM CS# DQS DQS DQ0 DQ DQ1 DQ DQ DQ2 DQ U1 DQ3 DQ4 DQ DQ5 ...

Page 7

General Description Micron’s FBDIMM devices adhere to the currently proposed industry specifications for FBDIMMs. The following specifications contain detailed information on FBDIMM de- sign, interfaces, and theory of operation and are listed here for the system designers’ convenience. Refer to ...

Page 8

Table 6: I Conditions (Continued) DD Symbol Condition I Training: Primary and secondary channels enabled; 100% toggle on all channel lanes; DD_TRAINING DRAMs idle; 0% bandwidth; CKE HIGH; Command and address lines stable; DDR2 SDRAM clock active I IBIST over ...

Page 9

Table 10: Serial Presence-Detect EEPROM AC Operating Conditions Parameter/Condition SCL LOW to SDA data-out valid Time the bus must be free before a new transition can start Data-out hold time SDA and SCL fall time Data-in hold time Start condition ...

Page 10

Module Dimensions Figure 4: 240-Pin DDR2 FBDIMM 66.68 (2.63) TYP 0.5 (0.02) R (4X 1.5 (0.059) R (4X) U10 U11 U12 2.6 (0.102) D (2X) 5.2 (0.205) TYP 1.25 (0.0492) Pin 1 TYP 1.0 (0.039) TYP 9.9 (0.39) ...

Page 11

S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 www.micron.com/productsupport Customer Comment Line: 800-932-4992 Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. This data ...

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