MC33394DWB Freescale Semiconductor, MC33394DWB Datasheet - Page 41

• Manufacturer Part Number: MC33394DWB
• Description: IC POWER SUPPLY MULT-OUT 54-SOIC
• Manufacturer: Freescale Semiconductor

Specifications of MC33394DWB

• Applications: Motorola MPC55x, MPC56x Microprocessors
• Interface: SPI Serial
• Voltage - Supply: 4 V ~ 26.5 V
• Package / Case: 54-SOIC (0.300", 7.50mm Width) Exposed Pad
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
27
1
C
2X 27 TIPS
0.3 A
5.15
PIN 1 INDEX
B C
10.3
7.6
7.4
A
A
B
VIEW C–C
Freescale Semiconductor, Inc.
0.30
6.6
5.9
For More Information On This Product,
54
28
A B
B
C
5
C
4
9
C
9
Go to: www.freescale.com
18.0
17.8
PACKAGE DIMENSIONS
B
54–LEAD SOICW–EP
PLASTIC PACKAGE
CASE 1377–01
DWB SUFFIX
33394
ISSUE B
2.65
2.35
0.30
R0.08 MIN
C L
4.8
4.3
54X
GAUGE PLANE
0.25
A
A B
52X
0.65
0.10
SEATING
PLANE
8
0
C
A
0.9
0.5
SECTION B–B
0
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
3. DATUMS B AND C TO BE DETERMINED AT THE
4. THIS DIMENSION DOES NOT INCLUDE MOLD
5. THIS DIMENSION DOES NOT INCLUDE
6. THIS DIMENSION DOES NOT INCLUDE DAMBAR
7. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
8. THESE DIMENSIONS APPLY TO THE FLAT
9. THE PACKAGE TOP MAY BE SMALLER THAN THE
MIN
0.30
0.25
ROTATED 90 CLOCKWISE
Y14.5M, 1994.
PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
FLASH, PROTRUSION OR GATE BURRS. MOLD
FLASH, PROTRUSION OR GATE BURRS SHALL
NOT EXCEED 0.15 MM PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH AND PROTRUSIONS SHALL
NOT EXCEED 0.25 MM PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD
WIDTH TO EXCEED 0.46 MM. DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR THE
FOOT. MINIMUM SPACE BETWEEN PROTRUSION
AND ADJACENT LEAD SHALL NOT LESS THAN
0.07 MM.
SECTION OF THE LEAD BETWEEN 0.1 MM AND
0.3 MM FROM THE LEAD TIP.
PACKAGE BOTTOM. THIS DIMENSION IS
DETERMINED AT THE OUTERMOST EXTREMES
OF THE PLASTIC BODY EXCLUSIVE OF MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTER–LEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF
THE PLASTIC BODY.
Ç Ç Ç Ç
É É É É
Ç Ç Ç Ç
É É É É
Ç Ç Ç Ç
É É É É
6
SECTION A–A
0.13
(0.29)
0.38
0.22
M
_
0.1
0.0
A B
(0.25)
C
BASE METAL
(1.43)
PLATING
8
41