EA-XPR-006 Embedded Artists, EA-XPR-006 Datasheet - Page 56

BOARD LPCXPRESSO LPC11C24

EA-XPR-006

Manufacturer Part Number
EA-XPR-006
Description
BOARD LPCXPRESSO LPC11C24
Manufacturer
Embedded Artists
Datasheets

Specifications of EA-XPR-006

Lead Free Status / Rohs Status
Lead free / RoHS Compliant
NXP Semiconductors
13. Soldering
LPC11CX2_CX4
Product data sheet
Fig 30. Reflow soldering of the LQFP48 package
Footprint information for reflow soldering of LQFP48 package
DIMENSIONS in mm
0.500
P1
0.560
P2
10.350
Hy
Ax
solder land
occupied area
Gy
10.350 7.350
Ay
C
Bx
7.350
By
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
P2
1.500
C
D2 (8×)
0.280
Rev. 3 — 27 June 2011
Generic footprint pattern
D1
P1
0.500
D2
Hx
Gx
Bx
Ax
7.500
Gx
7.500 10.650 10.650
(0.125)
Gy
32-bit ARM Cortex-M0 microcontroller
Hx
D1
Hy
LPC11Cx2/Cx4
By
© NXP B.V. 2011. All rights reserved.
Ay
sot313-2_fr
SOT313-2
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