TDA1519CTD NXP Semiconductors, TDA1519CTD Datasheet - Page 19

• Manufacturer Part Number: TDA1519CTD
• Manufacturer: NXP Semiconductors

Specifications of TDA1519CTD

• Operational Class: Class-B
• Audio Amplifier Output Configuration: 1-Channel Mono/2-Channel Stereo
• Output Power (typ): 22x1@4Ohm/11x2@2OhmW
• Audio Amplifier Function: Speaker
• Total Harmonic Distortion: 0.1@4Ohm@1W%
• Single Supply Voltage (typ): 14.4V
• Dual Supply Voltage (typ): Not RequiredV
• Power Supply Requirement: Single
• Power Dissipation: 25W
• Rail/rail I/o Type: No
• Single Supply Voltage (min): 6V
• Single Supply Voltage (max): 17.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Mounting: Surface Mount
• Pin Count: 20
• Package Type: HSOP
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
10. Hot bar or manual soldering is suitable for PMFP packages.
11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
2004 Jan 28
22 W BTL or 2
stereo power amplifier
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
11 W
19
Product specification
TDA1519C