A2F200M3F-FGG484 Actel, A2F200M3F-FGG484 Datasheet - Page 19

• Manufacturer Part Number: A2F200M3F-FGG484
• Description: ACLA2F200M3F-FGG484 SMART FUSION MIX SIG
• Manufacturer: Actel

Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not the
ambient, case, or board temperatures. This is an important distinction because dynamic and static power
consumption will cause the chip's junction temperature to be higher than the ambient, case, or board
temperatures.
gradient, and power.
where
Table 2-6 • Package Thermal Resistance
θ
θ
θ
T
T
T
T
P
Product
A2F200M3F-FG256
A2F200M3F-FG484
JA
JB
JC
A
J
B
C
= Junction-to-air thermal resistance
= Junction-to-board thermal resistance
= Junction-to-case thermal resistance
= Junction temperature
= Ambient temperature
= Board temperature (measured 1.0 mm away from the
= Case temperature
= Total power dissipated by the device
package edge)
EQ 1
through
X = 4.0; Y = 5.6
X = 5.10; Y = 7.3
Die Size
EQ 3
(mm)
give the relationship between thermal resistance, temperature
R e v i s i o n 3
θ
33.7
21.8
θ
θ
Still Air
JC
JA
JB
=
=
=
T
----------------- -
T
------------------ -
T
------------------ -
J
J
J
P
P
–
–
–
P
30.0
18.2
1.0 m/s
θ
T
T
A
B
C
θ
Actel SmartFusion Intelligent Mixed Signal FPGAs
JA
28.3
16.7
2.5 m/s
9.3
7.7
θ
JC
24.8
16.8
θ
JB
Units
°C/W
°C/W
EQ 1
EQ 2
EQ 3
2 -7