74HCT4067N,112 NXP Semiconductors, 74HCT4067N,112 Datasheet - Page 2
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74HCT4067N,112
Manufacturer Part Number
74HCT4067N,112
Description
IC MUX/DEMUX 1X16 24DIP
Manufacturer
NXP Semiconductors
Series
74HCTr
Datasheet
1.74HCT4067PW112.pdf
(29 pages)
Specifications of 74HCT4067N,112
Package / Case
24-DIP (0.600", 15.24mm)
Function
Multiplexer/Demultiplexer
Circuit
1 x 1:16
On-state Resistance
60 Ohm
Voltage Supply Source
Single Supply
Voltage - Supply, Single/dual (±)
4.5 V ~ 5.5 V
Current - Supply
50µA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Number Of Channels
1 Channel
On Resistance (max)
180 Ohm @ 4.5 V
On Time (max)
65 ns @ 4.5 V
Off Time (max)
60 ns @ 4.5 V
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Maximum Power Dissipation
750 mW
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Number Of Switches
Single
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-2862-5
933671060112
933671060112
NXP Semiconductors
4. Ordering information
Table 1.
74HC_HCT4067_3
Product data sheet
Type number
74HC4067
74HC4067N
74HC4067D
74HC4067DB
74HC4067PW
74HC4067BQ
74HCT4067
74HCT4067N
74HCT4067D
74HCT4067DB
74HCT4067PW
74HCT4067BQ
Ordering information
Package
Temperature range Name
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
DIP24
SO24
SSOP24
TSSOP24
DHVQFN24 plastic dual in-line compatible thermal enhanced very
DIP24
SO24
SSOP24
TSSOP24
DHVQFN24 plastic dual in-line compatible thermal enhanced very
Rev. 03 — 15 October 2007
Description
plastic dual in-line package; 24 leads (600 mil);
reverse bending
plastic small outline package; 24 leads;
body width 7.5 mm
plastic shrink small outline package; 24 leads;
body width 5.3 mm
plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
thin quad flat package; no leads; 24 terminals;
body 3.5
plastic dual in-line package; 24 leads (600 mil);
reverse bending
plastic small outline package; 24 leads;
body width 7.5 mm
plastic shrink small outline package; 24 leads;
body width 5.3 mm
plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
thin quad flat package; no leads; 24 terminals;
body 3.5
5.5
5.5
74HC4067; 74HCT4067
16-channel analog multiplexer/demultiplexer
0.85 mm
0.85 mm
© NXP B.V. 2007. All rights reserved.
Version
SOT101-1
SOT137-1
SOT340-1
SOT355-1
SOT815-1
SOT101-1
SOT137-1
SOT340-1
SOT355-1
SOT815-1
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