NOIL1SM0300A-QDC ON Semiconductor, NOIL1SM0300A-QDC Datasheet - Page 26

• Manufacturer Part Number: NOIL1SM0300A-QDC
• Manufacturer: ON Semiconductor

Specifications of NOIL1SM0300A-QDC

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Mechanical Package Specification
Die
(with Pin 1
to the left center)
Glass Lid
Mechanical shock
Vibration
Mounting Profile
Mechanical Specifications
Die thickness
Die center, X offset to the center of the package
Die center, Y offset to the center of the package
Die position, X tilt
Die position, Y tilt
Die placement accuracy in package
Die rotation accuracy
Optical center referenced from package center
(X−dir)
Optical center referenced from package center
(Y−dir)
Distance from PCB plane to top of the die surface
Distance from top of the die surface to top of the
glass lid
Thickness
Spectral range for window
Transmission of the glass lid
JESD22−B104C; Condition G
JESD22−B103B; Condition 1
Lead−free Infra−Red (IR) profile for LCC package if no socket is used
http://onsemi.com
26
−0.01
Min
−50
−50
−50
400
−1
−1
−1
20
0.74
1.25
Typ
6.1
7.1
0.6
0
0
0
0
1
1000
2000
2000
Max
0.01
50
50
50
92
1
1
1
Units
mm
deg
deg
deg
mm
mm
mm
mm
mm
mm
mm
mm
nm
Hz
%
G