NOIL1SC4000A-GDC ON Semiconductor, NOIL1SC4000A-GDC Datasheet
NOIL1SC4000A-GDC
Specifications of NOIL1SC4000A-GDC
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NOIL1SC4000A-GDC Summary of contents
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... The sensor uses a 3-wire SPI and is housed in a 127-pin ceramic PGA package. The LUPA4000 is available in mono and color option. ORDERING INFORMATION Marketing Part Number NOIL1SM4000A-GDC NOIL1SC4000A-GDC NOTE: Refer to Ordering Code Definition on page 26 for more information. © Semiconductor Components Industries, LLC, 2011 July, 2011 − Rev. 8 Description ...
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Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . ...
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... Operating ratings are conditions at which operation of the device is intended to be functional Semiconductor recommends that customers become familiar with, and follow the procedures in, JEDEC Standard JESD625−A. Refer to Application Note AN52561. 4. The LUPA4000 complies with JESD22−A114 HBM Class 0 and JESD22−C101 Class recommended that extreme care be taken while handling these devices to avoid damages due to ESD event. 5. The LUPA4000 does not have latch− ...
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Electrical Specifications POWER SUPPLY RATINGS Limits in bold apply for MIN Parameter Power Supply Parameters Vdd Core digital supply Idd Core digital current Vaa Analog supply voltage Iaa Analog supply current Vpix Pixel supply ...
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The LUPA4000 CMOS active pixel sensor features a global shutter with a maximum frame rate of 15 fps in full resolution. The readout speed is boosted by sub sampling and the windowed ROI readout. High dynamic range scenes can be ...
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The LUPA4000 architecture is shown in Figure 4. Image Core The image core consists of a pixel array, one X-addressing and two Y-addressing registers (only one drawn), pixel array drivers, and column amplifiers. The active pixel area is read out ...
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Pixel Array Drivers The image sensor has on-chip drivers for the pixel array signals The driving on system level is easy and flexible; the maximum currents applied to the sensor are also controlled on-chip. This means that the charging on ...
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Setting ADC Reference Voltages 2.5 V RHIGH_adc Vref_HIGH ~2 V RADC Vref_LOW ~1 V RLOW_adc gnd_33 Figure 7. Internal and External ADC Connections The LUPA4000 sensor operates in the global shutter mode. Global Shutter Mode In the global shutter mode, ...
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Integration Time Reset Handling N Readout FOT Handling É É É É É É É É É É É É É É É É É É É É É É É É É É É É É É É É ...
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Biasing and Analog Signals The expected analog output levels are between 0.3 V for a white, saturated, pixel and 1.3 V for a black pixel. There are two output stages, each consisting of two output amplifiers, resulting in four outputs. ...
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In Figure 11, levels are defined by the pixel array voltage supplies; for correct polarities of the signals see Table 4. The signals in Figure 11 are generated from the on-chip drivers. These on-chip drivers need two types of signals ...
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Spi_load (AH ): When the SPI register is uploaded, then the data is internally available on the rising edge of SPI_load. • [11] Sh_kol (AL ): Control signal of the column readout used in sample and ...
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TIMING AND READOUT OF IMAGE SENSOR The timing of the LUPA4000 sensor consists of two parts. The first part is related to the control of the pixels, the integration time, and the signal level. The second part is related to ...
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Timing specifications for each signal are shown in Table 6. • Falling edge of precharge is equal or later than falling edge of Vmem. • Sample is overlapping with precharge. • Rising edge of Vmem is more than 200 ns ...
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X and Y Addressing To read out a frame, the lines are selected sequentially. Figure 16 gives the timing to select the lines sequentially. This is done with a Clock_y and Sync_y signal. The Sync_y signals synchronizes the y-addressing and ...
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The figure shows Clock_x, Sync_x, internal selection pixel 1 and 2, internal selection pixel 3 and 4, internal selection pixel 5 and 6. The first pixel selected is the x-address downloaded in the SPI. The starting address is the number ...
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Figure 18. Output Signal Related to Clock_x Signal In the figure, shown from bottom to top: Clock_x, Sync_x and output. Output level before the first pixel is the level of the last pixel on previous line. As soon as Sync_x ...
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Backup Timing (ROT = 100 to 200 ns) Use a sample and hold function to reduce the ROT. Track the analog data using Sh_col during the first 100 ns during the selection of a new set of lines. After 100 ...
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Table 8. READOUT TIMING SPECIFICATIONS WITH PRECHARGING OF BUSES Symbol Serial Peripheral Interface The SPI is required to upload different modes. Table 9 shows the parameters and their bit position. Table ...
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Table 10 lists the pins and their functionalities. Table 10. PIN LIST (Notes 1, 2 and 3) Pad Pin Pin Name 1 E1 sync_x 2 F1 eos_x 3 D2 vdd 4 G2 clock_x 5 G1 eos_spi 6 F2 spi_data 7 ...
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Table 10. PIN LIST (Notes 1, 2 and 3) Pad Pin Pin Name 34 Q8 sh_col 35 R4 pre_col 36 R5 norowsel 37 R6 clock_y 38 R7 sync_y 39 K2 eos_y_r 40 Q9 temp_diode_p 41 Q10 temp_diode_n 42 R8 vpix ...
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Table 10. PIN LIST (Notes 1, 2 and 3) Pad Pin Pin Name 71 J15 vpre_l 72 J16 vdd 73 K15 vmem_h 74 K16 vmem_l 75 H15 adc2_ref_low 76 H16 adc2_linear_conv 77 G16 adc2_bit_9 78 F16 adc2_bit_8 79 E16 adc2_bit_7 ...
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Table 10. PIN LIST (Notes 1, 2 and 3) Pad Pin Pin Name 109 B6 precharge_bias 110 A8 photodiode 111 A7 gndd 112 B12 vdd 113 A6 eos_y_l 114 A1 sync_y 115 A5 clock_y 116 A2 norowsel 117 A3 volt. ...
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Package Drawing Figure 23. LUPA4000: 127 Pin PGA Package Drawing http://onsemi.com 24 001-07580 *C ...
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Mechanical Package Specification Mechanical Specifications Package Cavity Size (Pin 1 bottom left) Die Die size (with Pin 1 Die center, X offset to the center of package to the bottom left, Top View) Die center, Y offset to the center ...
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... Figure 24 shows the transmission characteristics of the glass lid. Figure 24. Transmission Characteristics of Glass Lid For proper handling and storage conditions, refer to the ON Semiconductor application note AN52561. ON Semiconductor’s Image Sensor Business Unit warrants that the image sensor products to be delivered hereunder, if properly used and serviced, will conform to Seller’ ...
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Acronym Description ADC analog-to-digital converter AFE analog front end ANSI American National Standards Institute BGA ball grid array BL black pixel data CDM Charged Device Model CDS correlated double sampling CIS CMOS image sensor CMOS complementary metal oxide semiconductor CMY ...
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The leakage of charge from a saturated pixel into neighboring pixels. camera gain constant A constant that converts the number of electrons collected by a pixel into digital output (in DN). It can be extracted from photon transfer curves. ...
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Noise due to variation in the reset level of a pixel pixel designs, this noise has a component (in units of volts) proportionality constant depending on how the pixel is reset (such as hard and soft). ...
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