74LVCV2G66GD,125 NXP Semiconductors, 74LVCV2G66GD,125 Datasheet
74LVCV2G66GD,125
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74LVCV2G66GD-G
935286865125
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74LVCV2G66GD,125 Summary of contents
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Overvoltage tolerant bilateral switch Rev. 3 — 16 June 2010 1. General description The 74LVCV2G66 is a low-power, low-voltage, high-speed Si-gate CMOS device. The 74LVCV2G66 provides two single pole single throw analog or digital switches. Each switch includes an ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 74LVCV2G66DP −40 °C to +125 °C 74LVCV2G66DC −40 °C to +125 °C 74LVCV2G66GD −40 °C to +125 °C 4. Marking Table 2. Marking codes Type number 74LVCV2G66DP 74LVCV2G66DC 74LVCV2G66GD [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning 74LVCV2G66 GND 4 001aai213 Fig 4. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) 6.2 Pin description Table 3. Pin description Symbol Pin 1Y 1Z GND 4 1E Functional description [1] Table 4: Function table Input [ HIGH voltage level LOW voltage level. 74LVCV2G66 ...
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... NXP Semiconductors 8. Limiting values Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I I input clamping current IK I switch clamping current SK V switch voltage SW I switch current ...
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... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions V HIGH-level input voltage LOW-level input voltage input leakage pin nE 5 GND current 5 OFF-state 5.5 V; see ...
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... NXP Semiconductors 10.1 Test circuits GND GND and V = GND or 5 Fig 6. Test circuit for measuring OFF-state leakage current 10.2 ON resistance Table 8. Resistance recommended operating conditions; voltages are referenced to GND (ground 0 V); for graphs see Symbol Parameter Conditions R ON resistance V ON(peak) SW (peak) ...
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... NXP Semiconductors 10.3 ON resistance test circuit and graphs GND GND to 5 Fig 8. Test circuit for measuring ON resistance 74LVCV2G66 Product data sheet (Ω 001aag490 / GND to 5 Fig 9. Typical ON resistance as a function of input voltage All information provided in this document is subject to legal disclaimers. Rev. 3 — 16 June 2010 ...
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... NXP Semiconductors 16 = +85 ° amb R ON +25 ° C (Ω) −40 ° +125 ° 2 (Ω 3 Fig 10. ON resistance as a function of input voltage at various supply voltages 74LVCV2G66 Product data sheet 001aaa537 (Ω ( 001aaa539 (Ω) = +85 ° C amb 12 +25 ° C −40 ° C +125 ° ( All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 11. Dynamic characteristics Table 9. Dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions t propagation delay nY; pd see Figure enable time nZ; en see Figure disable time nZ; dis see Figure power dissipation pF capacitance V = GND to 5 ...
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... NXP Semiconductors 11.1 Waveforms and test circuit Measurement points are given in Logic levels: V and V are typical output voltage levels that occur with the output load Fig 11. Input (nY or nZ) to output (nZ or nY) propagation delays nE input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points are given in ...
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... NXP Semiconductors Test data is given in Table 11. Definitions test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance External voltage for measuring switching times. EXT Fig 13. Load circuit for measuring switching times Table 11. Test data ...
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... NXP Semiconductors Table 12. Additional dynamic characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); T Symbol Parameter −3 dB frequency response f (−3dB) α isolation (OFF-state) iso V crosstalk voltage ct Xtalk crosstalk Q charge injection inj 74LVCV2G66 Product data sheet …continued Conditions = 600 Ω pF; ...
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... NXP Semiconductors 11.3 Test circuits Test conditions 2 (p-p 2.5 V (p-p 4 (p-p Fig 14. Test circuit for measuring total harmonic distortion Adjust f voltage to obtain 0 dBm level at output. Increase f i Fig 15. Test circuit for measuring the frequency response when switch is in ON-state f i Adjust f voltage to obtain 0 dBm level at input ...
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... NXP Semiconductors G Fig 17. Test circuit for measuring crosstalk voltage (between digital inputs and switch 600 Ω 20 log ( log Fig 18. Test circuit for measuring crosstalk between switches 74LVCV2G66 Product data sheet nY/nZ nZ/nY logic 50 Ω 600 Ω input 0.5V 0. 0.1 μ 600 Ω ...
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... NXP Semiconductors G a. Test circuit logic input (nE) b. Input and output pulse definitions = ΔV × inj O L ΔV = output voltage variation generator resistance. gen V = generator voltage. gen Fig 19. Test circuit for measuring charge injection 74LVCV2G66 Product data sheet gen nY/nZ nZ/nY ...
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... NXP Semiconductors 12. Application information Use the 74LVCV2G66 to reduce component count and footprint in low-power portable applications. Typical ‘66’ devices do not have low-power enable inputs causing a high ΔI power consumption in portable (battery) applications, a current limiting resistor is used. (see Figure ΔI , eliminating the necessity of the current limiting resistor (see CC Fig 20 ...
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... NXP Semiconductors 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 0.38 mm 1.1 0.25 0.00 0.75 0.22 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.85 0. 0.12 0.00 0.60 0.17 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 0.5 mm terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.35 2.1 3.1 mm 0.5 0.00 0.15 2.9 1.9 OUTLINE VERSION IEC SOT996 Fig 23. Package outline SOT996-2 (XSON8U) ...
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... Conditions for I 74LVCV2G66_2 20080703 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Added type number 74LVCV2G66GD (XSON8U package). 74LVCV2G66_1 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 17. Contact information For more information, please visit: For sales office addresses, please send an email to: 74LVCV2G66 Product data sheet 16 ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics 10.1 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 10.2 ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 ...