M29W320ET70ZE6E Micron Technology Inc, M29W320ET70ZE6E Datasheet - Page 45

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M29W320ET70ZE6E

Manufacturer Part Number
M29W320ET70ZE6E
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of M29W320ET70ZE6E

Cell Type
NOR
Density
32Mb
Access Time (max)
70ns
Interface Type
Parallel
Boot Type
Top
Address Bus
22/21Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TFBGA
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
4M/2M
Supply Current
10mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Compliant

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Figure 20. FBGA64 11 x 13 mm - 8 x 8 active ball array, 1 mm pitch, package outline, bottom view
Table 19.
Symbol
ddd
FD
SD
SE
A1
A2
D1
E1
FE
D
A
E
b
e
1. Drawing is not to scale.
FBGA64 11 x 13 mm—8 x 8 active ball array, 1 mm pitch, package mechanical data
E
BALL "A1"
11.00
0.48
0.80
7.00
1.00
13.0
7.00
2.00
3.00
0.50
0.50
Typ
FD
E1
FE
A
millimeters
e
10.90
12.90
0.43
0.55
Min
D1
D
SD
13.10
11.10
Max
1.40
0.53
0.65
0.15
b
A1
SE
0.0196
0.0196
0.018
0.031
0.433
0.275
0.039
0.275
0.078
0.511
0.118
A2
Typ
inches
0.016
0.021
0.429
0.507
Min
BGA-Z23
ddd
0.0059
0.055
0.025
0.437
0.515
Max
45/65

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