NOIL2SM1300A-GWC ON Semiconductor, NOIL2SM1300A-GWC Datasheet - Page 40

• Manufacturer Part Number: NOIL2SM1300A-GWC
• Manufacturer: ON Semiconductor

Specifications of NOIL2SM1300A-GWC

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Table 22. MECHANICAL SPECIFICATIONS
Die
(Pin 1 is located
bottom left)
Glass Lid
Mechanical Shock
Vibration
Mounting Profile
Recommended Socket
Manufacturer
Parameter
Die thickness
Die position, X offset to the package center
Die position, Y offset to the package center
Die position, X tilt
Die position, Y tilt
Die placement accuracy in package
Die rotation accuracy
Optical center referenced from the die center (X-dir)
Optical center referenced from the die center (Y-dir)
Distance from PCB plane to top of the die surface
Distance from top of the die surface to top of the glass lid
XY size
Thickness
Spectral range for optical coating of window
Reflection coefficient for window (refer to Figure 36)
JESD22-B104C; Condition G
JESD22-B103B; Condition 1
Pb-free wave soldering profile for pin grid array package if no socket is used
Andon Electronics (www.andonelectronics.com)
Description
http://onsemi.com
40
Min
400
NA
NA
NA
-50
NA
NA
NA
NA
NA
NA
NA
NA
20
-1
-1
-1
BGA Socket: 10-24-05-168-319T-P27-L14
Thru Hole: 10-24-05-168-347T-P27-L14
27.4 x 27.4
+2280
2000
-150
-121
1.75
1.15
<0.8
Typ
750
-42
0.9
0
0
0
0
-
-
1100
2000
Max
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
50
1
1
1
Units
deg
deg
deg
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
nm
Hz
%
G