TLE8262EXT Infineon Technologies, TLE8262EXT Datasheet - Page 9

• Manufacturer Part Number: TLE8262EXT
• Manufacturer: Infineon Technologies

Specifications of TLE8262EXT

• Operating Supply Voltage (typ): 9/12/15/18/24/28V
• Operating Supply Voltage (min): 5.5V
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 36
• Lead Free Status / Rohs Status: Supplier Unconfirmed

Pin
26
27
28
29
30
31
32
33
34
35
36
EDP
1) The exposed die pad at the bottom of the package allows better dissipation of heat from the SBC via the PCB. The exposed
Data Sheet
die pad is not connected to any active part of the IC and can be left floating or it can be connected to GND for the best EMC
performance.
Symbol
RxD
n.c.
n.c.
n.c.
n.c.
GND
n.c.
n.c
WK
Limp Home
Test
-
LIN
Function
LIN Transceiver Data Output; according to the ISO 9141 and LIN specification 2.1
as well as SAE J2602-2; push-pull output; LOW in dominant state.
Not connected
Not connected
Not connected
Not connected
Ground
Not connected
not connected
Monitoring / Wake-Up Input; bi-level sensitive input used to monitor signals
coming from, for example, an external switch panel; also used as wake-up input;
Fail-Safe Function Output; Open drain. Active LOW.
SBC SW Development Mode entry; Connect to GND for activation; Integrated pull-
up resistor. Connect to
Exposed Die Pad; For cooling purposes only, do not use it as an electrical ground.
V
S
9
or leave open for normal operation.
Rev. 1.0, 2009-03-31
Pin Configuration
TLE8262E
1)