LFXP10E-3FN256C Lattice, LFXP10E-3FN256C Datasheet - Page 391
LFXP10E-3FN256C
Manufacturer Part Number
LFXP10E-3FN256C
Description
IC FPGA 9.7KLUTS 188I/O 256-BGA
Manufacturer
Lattice
Datasheet
1.LFXP3C-3T100C.pdf
(397 pages)
Specifications of LFXP10E-3FN256C
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
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Manufacturer
Quantity
Price
Company:
Part Number:
LFXP10E-3FN256C
Manufacturer:
LATTICE
Quantity:
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Company:
Part Number:
LFXP10E-3FN256C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
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PCB Layout Recommendations
Lattice Semiconductor
for BGA Packages
pogo pin type probes are extremely small and can handle GHz range DC frequency. Zero ohm resistors are also
commonly used in first-run boards as a way to gain access to a pad or pin.
After assembly, BGA solder point quality and integrity is visually inspected with X-ray technology as part of the fab-
rication process. A special X-ray machine can look through the plastic package, substrate and silicon to directly
view the BGA solder balls, vias, traces and pads.
Figure 14-15. Example of How Defects May Appear in an X-Ray Image
The X-ray image in Figure 14-16 shows proper alignment; no voids or defects are noted. Balls, vias and traces are
visible.
Figure 14-16. X-Ray Inspection Plot of ispMACH 4000ZE 144-ball csBGA
(Photo Courtesy of CEM, Ltd., www.cemltd.com)
14-16
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