ISL54210IRTZ-T Intersil, ISL54210IRTZ-T Datasheet - Page 19

IC SWITCH DUAL SPDT HS 10-TDFN

ISL54210IRTZ-T

Manufacturer Part Number
ISL54210IRTZ-T
Description
IC SWITCH DUAL SPDT HS 10-TDFN
Manufacturer
Intersil
Datasheet

Specifications of ISL54210IRTZ-T

Function
Switch
Circuit
2 x SPDT
Voltage Supply Source
Single Supply
Voltage - Supply, Single/dual (±)
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
10-TDFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Products
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processing functions. Go to
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Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to
web to make sure you have the latest Rev.
3/18/10
1/6/09
7/2/08
DATE
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
For information regarding Intersil Corporation and its products, see
REVISION
FN6661.2
FN6661.1
FN6661.0
in the quality certifications found at
19
www.intersil.com/products
For additional products, see
Converted to New Intersil Template
Replaced note, page 3: “θ
conductivity test board in free air. See Tech Brief TB379 for details.” with “direct attached note”
Added “Boldface limits apply over the operating temperature range, -40°C to +85°C.” to
Electrical Specifications table.
On page 1 in “Related Literature” section added App Note AN1407.
On page 1 in “Features” section added “Low On Capacitance at 240MHz 4.2pF”
On page 2 added thermal pad (PD) to TDFN pinout and added PD column to “Pin Descriptions”
table.
Page 4 in “Abs Max Rating” section added HBM rating for COM pins of 6kV and Latchup level.
Thermal information Tjc for uTQFN changed from “61.9” to “105” and note for Tja was added
to reference no direct attach, added Tjc to show the case temp location at top center.
Page 4 in Electrical Spec Table - Removed Note Reference from Typical Column and Added to
specific specs in Audio Switches and USB Switches as follows: On Resistance, rON Matching
Between Channels and rON Flatness.
Page 6 in electrical specifications table added “On Capacitance at 240MHz parameter.
Page 15 Figure 20 Change from USB far end mask to USB near end mask.
Page 18 in “Die Characteristics” section added TDFN thermal pad potential.
Corrected Order Information.
Initial Release to web
ISL54210
http://rel.intersil.com/reports/search.php
ISL54210
JA
for a complete list of Intersil product families.
is measured with the component mounted on a high effective thermal
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CHANGE
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March 18, 2010
FN6661.2

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