HI9P0548-5Z Intersil, HI9P0548-5Z Datasheet - Page 24

• Manufacturer Part Number: HI9P0548-5Z
• Description: IC MULTIPLEXER 8X1 16SOIC
• Manufacturer: Intersil
• Type: Analog Multiplexerr

Specifications of HI9P0548-5Z

• Function: Multiplexer
• Circuit: 1 x 8:1
• On-state Resistance: 1.8 kOhm
• Voltage Supply Source: Dual Supply
• Voltage - Supply, Single/dual (±): ±5 V ~ 18 V
• Current - Supply: 0.5mA
• Operating Temperature: 0°C ~ 75°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Package: 16SOIC N
• Maximum On Resistance: 1800@±15V Ohm
• Maximum High Level Output Current: 20 mA
• Multiplexer Architecture: 8:1
• Maximum Turn-on Time: 300(Typ)@±15V ns
• Power Supply Type: Single|Dual
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Plastic Leaded Chip Carrier Packages (PLCC)
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
0.020 (0.51) MAX
3 PLCS
NOTES:
0.042 (1.07)
0.048 (1.22)
1. Controlling dimension: INCH. Converted millimeter dimensions are
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
4. To be measured at seating plane
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
not necessarily exact.
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
PIN (1) IDENTIFIER
0.045 (1.14)
MIN
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
C L
D1
D
0.026 (0.66)
0.032 (0.81)
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
For information regarding Intersil Corporation and its products, see www.intersil.com
0.050 (1.27) TP
VIEW “A” TYP.
24
0.042 (1.07)
0.056 (1.42)
E1
-C-
E
C L
0.025 (0.64)
MIN
0.013 (0.33)
0.021 (0.53)
contact point.
HI-546, HI-547, HI-548, HI-549
A
A1
-C-
0.004 (0.10)
D2/E2
D2/E2
0.025 (0.64)
0.045 (1.14)
SEATING
PLANE
VIEW “A”
0.020 (0.51)
MIN
R
C
N20.35
20 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
SYMBOL
D1
D2
A1
E1
E2
D
N
A
E
(JEDEC MS-018AA ISSUE A)
0.165
0.090
0.385
0.350
0.141
0.385
0.350
0.141
MIN
INCHES
20
MAX
0.180
0.120
0.395
0.356
0.169
0.395
0.356
0.169
MILLIMETERS
4.20
2.29
9.78
8.89
3.59
9.78
8.89
3.59
MIN
20
10.03
10.03
MAX
4.57
3.04
9.04
4.29
9.04
4.29
Rev. 2 11/97
NOTES
4, 5
4, 5
3
3
6
-
-
-
-