BAV23C NXP Semiconductors, BAV23C Datasheet

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... Dual high-voltage switching diodes Rev. 07 — 19 March 2010 1. Product profile 1.1 General description Dual high-voltage switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number BAV23A BAV23C BAV23S BAV23 1.2 Features and benefits  High switching speed: t  Low leakage current  ...

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... NXP Semiconductors 2. Pinning information Table 3. Pin BAV23A BAV23C BAV23S BAV23 BAV23_SER_7 Product data sheet Pinning Description cathode (diode 1) cathode (diode 2) common anode anode (diode 1) anode (diode 2) common cathode anode (diode 1) cathode (diode 2) cathode (diode 1), anode (diode 2) cathode (diode 1) cathode (diode 2) anode (diode 2) anode (diode 1) All information provided in this document is subject to legal disclaimers ...

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... Ordering information Table 4. Type number BAV23A BAV23C BAV23S BAV23 4. Marking Table 5. Type number BAV23A BAV23C BAV23S BAV23 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ...

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... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per device P tot amb T stg [1] Single diode loaded. [2] Double diode loaded C prior to surge. [ [4] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. ...

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... NXP Semiconductors 600 I F (mA) 400 200 ( 0.4 0.8 = 150 C (1) T amb = 85 C (2) T amb = 25 C (3) T amb = 40 C (4) T amb Fig 1. Forward current as a function of forward voltage; typical values = 150 C (1) T amb = 85 C (2) T amb = 25 C (3) T amb =  ...

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... NXP Semiconductors 1 (pF) 0.8 0.6 0.4 0  MHz; T amb Fig 4. Diode capacitance as a function of reverse voltage; typical values 8. Test information D.U. Ω × ( Fig 6. Reverse recovery time test circuit and waveforms BAV23_SER_7 Product data sheet mbg447 300 I F (mA) 200 100 (V) R FR4 PCB, standard footprint (1) Single diode loaded ...

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... Dimensions in mm Fig 7. Package outline SOT23 (TO-236AB) 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BAV23A BAV23C BAV23S BAV23 [1] For further information and the availability of packing methods, see BAV23_SER_7 Product data sheet 1.1 ...

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... NXP Semiconductors 11. Soldering 3 1.7 Fig 9. 2.6 4.6 Fig 10. Wave soldering footprint SOT23 (TO-236AB) BAV23_SER_7 Product data sheet 3.3 2.9 1.9 0.7 (3×) 0.5 (3×) 0.6 (3×) 1 Reflow soldering footprint SOT23 (TO-236AB) 2.2 1.2 (2×) 1.4 (2×) 1.4 2.8 4.5 All information provided in this document is subject to legal disclaimers. ...

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... NXP Semiconductors 0.7 (3×) 0.7 Fig 11. Reflow soldering footprint SOT143B 4.6 Fig 12. Wave soldering footprint SOT143B BAV23_SER_7 Product data sheet 3.25 0.6 (3×) 0.5 (3×) 1.9 0.6 (3×) 0.6 0.75 0.95 0.9 1 4.45 2.2 2.575 1.2 All information provided in this document is subject to legal disclaimers. ...

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... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date BAV23_SER_7 20100319 • Modifications: Type numbers BAV23A/DG, BAV23C/DG, BAV23S/DG and BAV23/DG deleted • Type numbers BAV23A and BAV23C added • Table 5 “Marking • Figure • Figure • Section 13 “Legal BAV23_SER_6 20080303 ...

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... NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. ...

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... NXP Semiconductors 14. Contact information For more information, please visit: For sales office addresses, please send an email to: BAV23_SER_7 Product data sheet http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 07 — 19 March 2010 BAV23 series Dual high-voltage switching diodes © ...

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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information . . . . . . . . . . . . . . . . . . . . . 7 11 Soldering ...