MT46H32M16LFBF-6 AT:C Micron Technology Inc, MT46H32M16LFBF-6 AT:C Datasheet - Page 15

• Manufacturer Part Number: MT46H32M16LFBF-6 AT:C
• Manufacturer: Micron Technology Inc

Specifications of MT46H32M16LFBF-6 AT:C

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Package Dimensions
Figure 6: 60-Ball VFBGA (8mm x 9mm), Package Code: BF
PDF: 09005aef83dd2b3e
t67m_512mb_mobile_lpddr.pdf - Rev. E 6/11 EN
Dimensions apply to
solder balls post-reflow
on Ø0.40 SMD ball pads.
Solder ball material: SAC105
(98.5% Sn, 1% Ag, 0.5% Cu).
9 ±0.1
7.2 CTR
60X Ø0.45
0.8 TYP
Note:
1. All dimensions are in millimeters.
9
8
7
0.8 TYP
6.4 CTR
8 ±0.1
(covered by SR)
3
Ball A1 ID
2
1
B
D
E
F
H
K
15
A
C
G
J
A
512Mb: x16, x32 Mobile LPDDR SDRAM
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Seating plane
0.12 A
0.275 MIN
0.9 ±0.1
Package Dimensions
© 2009 Micron Technology, Inc. All rights reserved.
Ball A1 ID