MT46H32M16LFBF-6 AT:C Micron Technology Inc, MT46H32M16LFBF-6 AT:C Datasheet - Page 16

• Manufacturer Part Number: MT46H32M16LFBF-6 AT:C
• Manufacturer: Micron Technology Inc

Specifications of MT46H32M16LFBF-6 AT:C

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Figure 7: 90-Ball VFBGA (8mm x 13mm), Package Code: B5
PDF: 09005aef83dd2b3e
t67m_512mb_mobile_lpddr.pdf - Rev. E 6/11 EN
13 ±0.1
Dimensions apply to
solder balls post-reflow
on Ø0.40 SMD ball pads.
Solder ball material:
SAC305 (96.5% Sn, 3% Ag,
0.5% Cu) OR
SAC105 (98.5% Sn, 1% Ag,
0.5% Cu).
11.2 CTR
90X Ø0.45
0.8 TYP
Note:
1. All dimensions are in millimeters.
9
8
7
6.4 CTR
8 ±0.1
0.8 TYP
(covered by SR)
3
2
Ball A1 ID
1
B
D
E
F
H
K
L
M
N
P
R
A
C
G
J
16
A
512Mb: x16, x32 Mobile LPDDR SDRAM
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Seating plane
0.12 A
0.275 MIN
0.9 ±0.1
Package Dimensions
© 2009 Micron Technology, Inc. All rights reserved.
Ball A1 ID