TD62003AP Toshiba, TD62003AP Datasheet
TD62003AP
Specifications of TD62003AP
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TD62003AP Summary of contents
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... TD62002AP/AF Zenner diode TD62003AP/AF 2.7 kΩ TD62004AP/AF 10.5 kΩ Pin Connection (top view) TD62001AP, TD62002AP TD62003AP, TD62004AP TD62001AF, TD62002AF TD62003AF, TD62004AF Designation General purpose 14-V to 25-V PMOS Weight DIP16-P-300-2.54A: 1.11 g (typ.) TTL, 5-V CMOS SOP16-P-225-1.27: 0.16 g (typ.) 6-V to 15-V PMOS, ...
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... Note 3: When mounted on a glass-epoxy PCB (30 mm × × 1.6 mm, Cu area: 50%) TD62002AP/AF (Ta = 25°C) Symbol Rating Unit −0 (SUS) I 500 mA/ch OUT V IN −0 (Note (Note 500 0.625 (Note 3) − °C opr −55 to 150 T °C stg 2 TD62001~004AP/AF TD62003AP/AF 2006-06-13 ...
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Recommended Operating Conditions Characteristics Output sustaining voltage AP Output current AF Except Input voltage TD62001AP/A F TD62002 Input voltage (output on) TD62003 TD62004 TD62001 TD62002 Input voltage (output off) TD62003 TD62004 Input current Only TD62001 Clamp diode reverse voltage Clamp ...
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Electrical Characteristics (Ta = 25°C unless otherwise noted) Characteristics Ooutput leakage current Collector−emitter saturation voltage DC current transfer ratio TD62002 Input current (output on) TD62003 TD62004 Input current (output off) TD62002 Input voltage (output on) TD62003 TD62004 Clamp diode reverse ...
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Test Circuit 1. I CEX (OFF (sat (ON) 5 TD62001~004AP/AF 3. IIN (ON 2006-06-13 ...
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... Output impedance 50 Ω Note 2: Input conditions are shown as following: Input Condition Type Number TD62001AP/AF TD62002AP/AF TD62003AP/AF TD62004AP/AF Note 3: C includes probe and jig capacitance. L Precautions for Using This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. ...
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TD6200XAF TD6200XAP TD62001~004AP/AF TD6200XAP 7 TD6200XAF 2006-06-13 ...
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TD62001~004AP/AF 8 2006-06-13 ...
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TD62001~004AP/AF 9 2006-06-13 ...
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... TD62001AP/AF TD62002AP/AF TD62003AP/AF TD62004AP/AF Type-AP Free-Air ① ② Type-AF Glass Epoxy PCB 30×30×1.6mm Cu 50% Type-AF Free Air ③ 10 TD62001~004AP/AF 2006-06-13 ...
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Package Dimensions Weight: 1.11 g (Typ.) TD62001~004AP/AF 11 2006-06-13 ...
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Package Dimensions Weight: 0.16 g (Typ.) TD62001~004AP/AF 12 2006-06-13 ...
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Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the ...
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Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the ...
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... TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property ...