TD62064AFG Toshiba, TD62064AFG Datasheet - Page 10
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TD62064AFG
Manufacturer Part Number
TD62064AFG
Description
Manufacturer
Toshiba
Datasheet
1.TD62064AFG.pdf
(11 pages)
Specifications of TD62064AFG
Polarity
NPN
Number Of Elements
4
Collector-emitter Voltage
50V
Collector-emitter Saturation Voltage
1.6V
Collector Current (dc) (max)
1.5A
Dc Current Gain
800
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
18
Package Type
HSOP
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TD62064AFG
Manufacturer:
TOSHIBA
Quantity:
12 500
Part Number:
TD62064AFG
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Company:
Part Number:
TD62064AFG(5
Manufacturer:
Toshiba
Quantity:
21 800
Company:
Part Number:
TD62064AFG(5,S)
Manufacturer:
TI
Quantity:
124
About solderability, following conditions were confirmed
• Solderability
Points to Remember on Handling of ICs
(1) Use of Sn-37Pb solder Bath
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
(1)
(2)
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device
so that heat is appropriately radiated, not to exceed the specified junction temperature (T
and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation
design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition,
please design the device taking into considerate the effect of IC heat radiation with peripheral
components.
Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply
is small, the device’s motor power supply and output pins might be exposed to conditions beyond
maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system
design.
10
TD62064APG/AFG
2011-01-14
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