AM29F016D-120FC Spansion Inc., AM29F016D-120FC Datasheet
AM29F016D-120FC
Specifications of AM29F016D-120FC
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AM29F016D-120FC Summary of contents
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... For More Information Please contact your local sales office for additional information about Spansion memory solutions. Publication Number 26244 Revision A Amendment 4 Am29F016D Known Good Die Cover Sheet Issue Date March 3, 2009 ...
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... This page left intentionally blank Am29F016D Known Good Die 26244_A4 March 3, 2009 ...
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... SUPPLEMENT Am29F016D Known Good Die 16 Megabit ( 8-Bit) CMOS 5.0 Volt-only, Sector Erase Flash Memory—Die Revision 1 This product has been retired and is not recommended for designs. Please contact your Spansion representative for alternates. Availability of this document is retained for reference and historical purposes only. ...
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... GENERAL DESCRIPTION The Am29F016D in Known Good Die (KGD) form Mbit, 5.0 volt-only Flash memory. AMD defines KGD as standard product in die form, tested for functionality and speed. AMD KGD products have the same reliability and quality as AMD products in packaged form. Am29F016D Features The Am29F016D Mbit, 5 ...
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... DIE PHOTOGRAPH DIE PAD LOCATIONS AMD logo location 21 22 Am29F016D Known Good Die 30 29 26244A4 March 3, 2009 ...
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... Am29F016D Known Good Die Pad Center (millimeters 0.80 2.31 –0.83 2.40 –1.09 2.31 –1.24 2.31 –1.40 2.31 –1.55 2.31 –1.71 2.31 –1.87 2.31 – ...
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... Am29F016D Known Good Die Pad Center (millimeters 0.00 0.00 –1.63 0.09 –1.88 0.00 –2.04 0.00 –2.20 0.00 –2.35 0.00 –2.51 0.00 –2.67 0.00 – ...
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... WF = Wafer Jar, 280 µm thickness WJ = Wafer Jar, 500 µm thickness SPEED OPTION See Product Selector Guide and Valid Combinations Valid Combinations DPC 1, DPI 1, DFC 1, DFI 1, DRC 1, DRI 1, DTC 1, DTI 1, WFC 1, WFI 1, WJC 1, WJI 1 Am29F016D Known Good Die C) 8 ...
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... PACKAGING INFORMATION Surftape Packaging Direction of Feed Waffle Pack Packaging Orientation relative to top left corner of Waffle Pack cavity plate Am29F016D Known Good Die Orientation relative to leading edge of tape and reel AMD logo location AMD logo location 26244A4 March 3, 2009 ...
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... PRODUCT TEST FLOW Figure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29F016D product qualification database supple- ment for KGD. AMD implements quality assurance pro- cedures throughout the product test flow. In addition, 24 hours at 250°C ...
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... AMD recommends assembly in a Class 10K clean room with 30% to 60% relative humidity. (max) = 130°C Storage J Store at a maximum temperature of 30° nitrogen- purged cabinet or vacuum-sealed bag. Observe all standard ESD handling procedures. Am29F016D Known Good Die 26244A4 March 3, 2009 ...
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... Die can reason- ably be expected to result in a personal injury. Buyer’s use of Known Good Die for use in life support applica- tions is at Buyer’s own risk and Buyer agrees to fully indemnify AMD for any damages resulting in such use or sale. Am29F016D Known Good Die 12 ...
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... Added 280 µm dimensions. Revision A3 (July 18, 2007) Ordering Information Moved Valid Combination text and table Revision A4 (March 3, 2009) Global Added obsolescence information. ® , the Spansion Logo, MirrorBit Am29F016D Known Good Die ® ® ™ ™ , MirrorBit Eclipse , ORNAND , 26244A4 March 3, 2009 ...