AM29F016D-120FC Spansion Inc., AM29F016D-120FC Datasheet - Page 4

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AM29F016D-120FC

Manufacturer Part Number
AM29F016D-120FC
Description
Manufacturer
Spansion Inc.
Datasheet

Specifications of AM29F016D-120FC

Cell Type
NOR
Density
16Mb
Access Time (max)
120ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
21b
Operating Supply Voltage (typ)
5V
Operating Temp Range
0C to 70C
Package Type
RTSOP
Program/erase Volt (typ)
4.5 to 5.5V
Sync/async
Asynchronous
Operating Temperature Classification
Commercial
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Word Size
8b
Number Of Words
2M
Supply Current
40mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant

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Quantity
Price
Part Number:
AM29F016D-120FC
Manufacturer:
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Quantity:
1 000
Part Number:
AM29F016D-120FC
Manufacturer:
AMD
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20 000
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Part Number:
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GENERAL DESCRIPTION
The Am29F016D in Known Good Die (KGD) form is a 16
Mbit, 5.0 volt-only Flash memory. AMD defines KGD as
standard product in die form, tested for functionality and
speed. AMD KGD products have the same reliability and
quality as AMD products in packaged form.
Am29F016D Features
The Am29F016D is a 16 Mbit, 5.0 volt-only Flash
memory organized as 2,097,152 bytes of 8 bits each.
The 2 Mbytes of data are divided into 32 sectors of 64
Kbytes each for flexible erase capability. The 8 bits of
data appear on DQ0–DQ7. The Am29F016D is
manufactured using AMD’s 0.32 µm process technology.
This device is designed to be programmed in-system
with the standard system 5.0 volt V
V
The device can also be programmed in standard
EPROM programmers.
The standard device offers an access time of 120 ns,
allowing high-speed microprocessors to operate without
wait states. To eliminate bus contention, the device has
separate chip enable (CE#), write enable (WE#), and
output enable (OE#) controls.
The device is entirely command set compatible with the
JEDEC single-power-supply Flash standard. Com-
mands are written to the command register using stan-
dard microprocessor write timings. Register contents
serve as input to an internal state machine that controls
the erase and programming circuitry. Write cycles also
internally latch addresses and data needed for the pro-
gramming and erase operations. Reading data out of the
device is similar to reading from 12.0 volt Flash or
EPROM devices.
The device is programmed by executing the program
command sequence. This invokes the Embedded
Program algorithm—an internal algorithm that automat-
ically times the program pulse widths and verifies proper
cell margin. The device is erased by executing the erase
command sequence. This invokes the Embedded Erase
algorithm—an internal algorithm that automatically pre-
programs the array (if it is not already programmed)
before executing the erase operation. During erase, the
device automatically times the erase pulse widths and
verifies proper cell margin.
PRODUCT SELECTOR GUIDE
March 3, 2009 26244A4
Family Part Number
Speed Option (V
Max Access Time, t
Max CE# Access, t
Max OE# Access, t
PP
is not required for program or erase operations.
CC
CE
OE
ACC
= 5.0 V ± 10%)
(ns)
(ns)
(ns)
CC
supply. A 12.0 volt
Am29F016D Known Good Die
S U P P L E M E N T
The sector erase architecture allows memory sectors to
be erased and reprogrammed without affecting the data
contents of other sectors. A sector is typically erased
and verified within one second. The device is erased
when shipped from the factory.
The hardware sector group protection feature disables
both program and erase operations in any combination
of the eight sector groups of memory. A sector group
consists of four adjacent sectors.
The Erase Suspend feature enables the system to put
erase on hold for any period of time to read data from, or
program data to, a sector that is not being erased. True
background erase can thus be achieved.
The device requires only a single 5.0 volt power supply
for both read and write functions. Internally generated
and regulated voltages are provided for the program and
erase operations. A low V
inhibits write operations during power transitions. The
host system can detect whether a program or erase
cycle is complete by using the RY/BY# pin, the DQ7
(Data# Polling) or DQ6 (toggle) status bits. After a
program or erase cycle has been completed, the device
automatically returns to the read mode.
A hardware RESET# pin terminates any operation in
progress. The internal state machine is reset to the read
mode. The RESET# pin may be tied to the system reset
circuitry. Therefore, if a system reset occurs during
either an Embedded Program or Embedded Erase algo-
rithm, the device is automatically reset to the read mode.
This enables the system’s microprocessor to read the
boot-up firmware from the Flash memory.
AMD’s Flash technology combines years of Flash
memory manufacturing experience to produce the
h i g h e s t l eve l s o f q u a l i t y, r e l i a b i l i t y, a n d c o s t
effectiveness. The device electrically erases all bits
within a sector simultaneously via Fowler-Nordheim tun-
neling. The bytes are programmed one byte at a time
using the EPROM programming mechanism of hot elec-
tron injection.
Electrical Specifications
Refer to the Am29F016D data sheet, publication
number 21444, for full electrical specifications on the
Am29F016D in KGD form.
Am29F016D KGD
CC
-120
120
120
50
detector automatically
4

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