AM29LV640MB90REI Spansion Inc., AM29LV640MB90REI Datasheet - Page 5

• Manufacturer Part Number: AM29LV640MB90REI
• Manufacturer: Spansion Inc.

Specifications of AM29LV640MB90REI

• Cell Type: NOR
• Density: 64Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 23/22Bit
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 3 to 3.6V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 8M/4M
• Supply Current: 20mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

MIRRORBIT 64 MBIT DEVICE FAMILY
RELATED DOCUMENTS
To download related documents, click on the following
links or go to
uct Information
nical Documentation.
MirrorBit™ Flash Memory Write Buffer Programming
and Page Buffer Read
February 1, 2007 26190C8
Device
LV065MU
LV640MT/B
LV640MH/L
LV641MH/L
LV640MU
x8/x16
x8/x16
Bus
x16
x16
www.amd.com
x8
→
MirrorBit
Sector Architecture
Uniform (32 Kword)
Uniform (32 Kword)
Uniform (64 Kbyte)
Uniform (64 Kbyte)
Boot (8 x 8 Kbyte
at top & bottom)
→
Flash Information
→
Flash Memory
48-pin TSOP, 63-ball Fine-pitch BGA,
48-pin TSOP (std. & rev. pinout),
56-pin TSOP (std. & rev. pinout),
48-pin TSOP (std. & rev. pinout)
D A T A
63-ball Fine-pitch BGA
→
→
64-ball Fortified BGA,
64-ball Fortified BGA
64-ball Fortified BGA
Am29LV640MT/B
Prod-
Tech-
63-ball FBGA
Packages
S H E E T
Implementing a Common Layout for AMD MirrorBit
and Intel StrataFlash Memory Devices
Migrating from Single-byte to Three-byte Device IDs
AMD MirrorBit™ White Paper
Yes
Yes
Yes
Yes
V
No
IO
RY/BY#
Yes
Yes
Yes
Yes
No
Separate WP#
WP#/ACC pin
WP#/ACC pin
and ACC pins
WP#, ACC
ACC only
ACC only
WP# Protection
top or bottom
top or bottom
1 x 32 Kword
1 x 64 Kbyte
2 x 8 Kbyte
high or low
No WP#
No WP#
3