LH28F008SAHT-T9 Sharp Electronics, LH28F008SAHT-T9 Datasheet - Page 21

LH28F008SAHT-T9

Manufacturer Part Number
LH28F008SAHT-T9
Description
Manufacturer
Sharp Electronics
Datasheet

Specifications of LH28F008SAHT-T9

Cell Type
NOR
Density
8Mb
Access Time (max)
90ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
20b
Operating Supply Voltage (typ)
5V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
11.4 to 12.6V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Word Size
8b
Number Of Words
1M
Supply Current
50mA
Mounting
Surface Mount
Pin Count
40
Lead Free Status / Rohs Status
Compliant
10. ABSOLUTE MAXIMUM RATINGS*
Operating Temperature
During Read .........................................-40˚C to +85˚C
During Block Erase/Byte Write ................-40˚C to +85˚C
Temperature Under Bias
Storage Temperature
Voltage on Any Pin
(except V
with Respect to GND
V
Respect to GND during
Block Erase/Byte Write
V
with Respect to GND
Output Short Circuit Current
11. OPERATING CONDITIONS
NOTE:
1. ±0.25V V
12. DC CHARACTERISTICS
I
I
I
I
I
PP
CC
Symbol
T
V
V
Symbol
LI
LO
CCS
CCD
CCR
A
CC
CC
LH28F008SA-85 in its Standard configuration.
Supply Voltage
Program Voltage with
CC
CC
and V
Input Load Current
Output Leakage Current
V
V
Current
V
Operating Temperature
V
V
specifications reference the LH28F008SA-85 in its High Speed configuration. ±0.5V V
CC
CC
CC
CC
CC
Supply Voltage (5V±0.5V)
Supply Voltage (5V±0.25V)
Standby Current
Deep PowerDown
Read Current
PP
Parameter
)
Parameter
..........................-2.0V to +7.0V
.........................-2.0V to +7.0V
........................-65˚C to +125˚C
.................-2.0V to +14.0V
.....................-40˚C to +85˚C
...........................100mA
Notes
1,3
1
1
1
1
Notes Min.
T
1
1
A
LHF08ST9
(2,3)
Min.
=-40 to +85℃
(1)
(2)
(2)
(4)
4.50
4.75
-40
Typ.
NOTES:
1. Operating temperature is for extended temperature product
2. All specified voltages are with respect to GND. Minimum DC
3. Maximum DC voltage on V
4. Output shorted for no more than one second. No more than
* WARNING: Stressing the device beyond the "Absolute
1.0
0.2
30
20
25
Maximum Ratings" may cause permanent damage.
These are stress ratings only. Operation beyond the
"Operating Conditions" is not recommended and
extended exposure beyond the "Operating Conditions"
may affect device reliability.
defined by this specification.
voltage is -0.5V on input/output pins and -0.2V on V
V
-2.0V for periods <20ns. Maximum DC voltage on input/output
pins, V
may overshoot to V
periods <20ns.
one output shorted at a time.
Max.
5.50
5.25
+85
PP
pins. During transitions, this level may undershoot to
Max.
±1.0
±10
100
2.0
20
35
50
CC
Unit
and RP# pin is V
°C
V
V
Unit
mA
mA
mA
µA
µA
µA
µA
CC
+2.0V for periods <20ns.
V
V
V
V
V
CE#=RP#=V
V
CE#=RP#=V
RP#=GND±0.2V
I
V
f=8MHz, I
CMOS Inputs
V
f=8MHz, I
TTL Inputs
OUT
CC
IN
CC
OUT
CC
CC
CC
CC
CC
PP
=V
CC
=V
=V
=V
=V
=V
=V
(RY/BY#)=0mA
+0.5V which, during transitions,
=V
may overshoot to +14.0V for
specifications reference the
CC
CC
CC
CC
CC
CC
CC
Test Condition
CC
or GND
OUT
OUT
Max.
Max.
Max.
Max.
Max., CE#=GND
Max., CE#=V
or GND
IH
CC
=0mA
=0mA
±0.2V
CC
IL
and
18

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