TE28F800B3TA110 Intel, TE28F800B3TA110 Datasheet - Page 30
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TE28F800B3TA110
Manufacturer Part Number
TE28F800B3TA110
Description
Manufacturer
Intel
Datasheet
1.TE28F800B3TA110.pdf
(70 pages)
Specifications of TE28F800B3TA110
Cell Type
NOR
Density
8Mb
Access Time (max)
110ns
Interface Type
Parallel
Boot Type
Top
Address Bus
19b
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
16b
Number Of Words
512K
Supply Current
18mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TE28F800B3TA110
Manufacturer:
INTEL
Quantity:
1 871
Part Number:
TE28F800B3TA110
Manufacturer:
INTEL
Quantity:
20 000
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
30
Figure 9. x16 48-Ball VF BGA and µBGA* Chip Size Package (Top View, Ball Down)
NOTES:
1. A19, A20, and A21 indicate the upgrade address connections. Lower density devices will not have the upper
2.
address solder balls. Intel recommends that routing is not done in this area. A
the
16-Mbit device. A
device.
Table 8, “B3 Flash memory Device Signal Descriptions” on page 31
C
D
A
B
E
F
20
V
A13
A14
A15
A16
Vss
CCQ
1
is the upgrade address for the 32-Mbit device. A
D14
D15
A11
A10
A12
D7
2
WE#
D13
D5
D6
A8
A9
3
64M
RP#
D11
D12
A21
V
D4
4
PP
32M
WP#
A18
A20
V
D2
D3
5
CC
16M
D10
A19
A17
D8
D9
A6
6
21
details the usage of each device pin.
is the upgrade address for the 64-Mbit
CE#
A7
A5
A3
D0
D1
7
19
is the upgrade address for
OE#
Vss
A4
A2
A1
A0
8
Datasheet
0580_03