UDA1341TS NXP Semiconductors, UDA1341TS Datasheet - Page 31

• Manufacturer Part Number: UDA1341TS
• Manufacturer: NXP Semiconductors
• Type: General Purposer

Specifications of UDA1341TS

• Adc/dac Resolution: 20b
• Number Of Adc's: 4
• Number Of Dac's: 2
• Interface Type: Serial (I2S)/L3
• Power Supply Type: Analog/Digital
• Operating Supply Voltage (min): 2.4V
• Operating Supply Voltage (typ): 3V
• Operating Supply Voltage (max): 3.6V
• Sample Rate: 48KSPS
• Pin Count: 28
• Operating Temperature (min): -20C
• Operating Temperature (max): 85C
• Screening Level: Commercial
• Package Type: SSOP
• Mounting: Surface Mount
• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
15.5
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
2002 May 16
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Economy audio CODEC for MiniDisc (MD)
home stereo and portable applications
from your NXP Semiconductors sales office.
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
The package footprint must incorporate solder thieves downstream and at the side corners.
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(4)
Suitability of surface mount IC packages for wave and reflow soldering methods
, SO, SOJ
PACKAGE
(1)
31
not suitable
not suitable
suitable
not recommended
not recommended
WAVE
(3)
SOLDERING METHOD
(4)(5)
(6)
suitable
suitable
suitable
suitable
suitable
UDA1341TS
Product specification
REFLOW
(2)