CY7C65640-LFC Cypress Semiconductor Corp, CY7C65640-LFC Datasheet - Page 25

• Manufacturer Part Number: CY7C65640-LFC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C65640-LFC

• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Operating Temperature (max): 70C
• Rad Hardened: No
• Lead Free Status / Rohs Status: Not Compliant

15.0
16.0
The TetraHub is available in a space-saving 56-pin QFN (8 X 8 mm)
Note:
The bottom metal pad size varies by product due to die size variable. If metal pad design or dimension are critical with your board
designs, please contact Cypress Sales office to get the specific outline option.
16.1
The QFN (Quad Flatpack No Leads), being a lead free package, the electrical contact of the part to the Printed Circuit Board
(PCB) is made by soldering the lands on the bottom surface of the package to the PCB. Hence special attention is required to
the heat transfer area below the package to provide a good thermal bond to the circuit board. A Copper (Cu) fill should be designed
into the PCB as a thermal pad under the package. Heat is transferred from the TeraHub through the device’s metal paddle on the
bottom side of the package. Heat from here is conducted to the PCB at the thermal pad. It is then conducted from the thermal
pad to the PCB inner ground plane by a 5 x 5 array of Via. A Via is a plated through-hole in the PCB with a finished diameter of
13 mil. The QFN’s metal die paddle must be soldered to the PCB’s thermal pad. Solder mask is placed on the board top side over
each Via to resist solder flow into the Via. The mask on the top side also minimizes outgassing during the solder reflow process.
Please follow the layout guidelines provided in the PCB layout files accompanied with the CY4602 TetraHub Reference Design
Kit. The information in this section was derived from the original application note by the package vendor. For further information
on this package design please refer to the application note “Surface Mount Assembly of AMKOR’s MicroLeadFrame (MLF)
Technology”. This application note can be downloaded from AMKOR’s website from the following URL
http://www.amkor.com/products/notes_papers/MLF_AppNote_0301.pdf.
This application note provides detailed information on board mounting guidelines, soldering flow, rework process, etc.
Document #: 38-08019 Rev. *E
CY7C65640-LFC
CY7C65640-LFXC
CY4602
Dimensions are in milimeters
Quad Flat Package No Leads (QFN) Package Design Notes
Ordering Information
Package Diagrams
0.80[0.031]
DIA.
A
1
2
N
Ordering Code
7.90[0.311]
8.10[0.319]
TOP VIEW
7.70[0.303]
7.80[0.307]
MAX
MIN
56-Lead QFN 8 x 8 MM LF56A
0.80[0.031] MAX.
1.00[0.039] MAX.
SIDE VIEW
0°-12°
C
56-pin QFN
56-pin QFN Lead Free Package
TetraHub USB 2.0 4 port Hub Reference Design Kit
0.05[0.002] MAX.
0.20[0.008] REF.
0.08[0.003]
SEATING
PLANE
0.30[0.012]
0.50[0.020]
C
6.45[0.254]
6.55[0.258]
(PAD SIZE VARY
BY DEVICE TYPE)
BOTTOM VIEW
Package Type
E-PAD
0.18[0.007]
0.28[0.011]
0.50[0.020]
N
1
2
PIN1 ID
0.20[0.008] R.
0.24[0.009]
0.60[0.024]
0.45[0.018]
CY7C65640
(4X)
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