CY7C65640-LFC Cypress Semiconductor Corp, CY7C65640-LFC Datasheet - Page 26

• Manufacturer Part Number: CY7C65640-LFC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C65640-LFC

• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Operating Temperature (max): 70C
• Rad Hardened: No
• Lead Free Status / Rohs Status: Not Compliant

Figure 16-1 below displays a cross-sectional area underneath the package. The cross section is of only one via. The solder Paste
template needs to be designed to allow at least 50% solder coverage. The thickness of the solder paste template should be 5mil.
It is recommended that “No Clean”, type 3 solder paste is used for mounting the part. Nitrogen purge is recommended during
reflow.
Figure 16-2a is a plot of the solder mask pattern and Figure 16-2b displays an X-Ray image of the assembly (darker areas indicate
solder).
TetraHub is a trademark of Cypress Semiconductor Corporation. All product and company names mentioned in this document
may be the trademarks of their respective holders.
Document #: 38-08019 Rev. *E
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
Figure 16-2a. Plot of the Solder Mask (White Area)
Via hole for thermally connecting the
QFN to the circuit board ground plane.
Figure 16-1. Cross-section of the Area Underneath the QFN Package
PCB Material
Cu Fill
Solder Mask
0.013” dia
0.017” dia
This figure only shows the top three layers of the
circuit board: Top Solder, PCB Dielectric, and
the Ground Plane.
Figure 16-2b. X-Ray Image of the Assembly
Cu Fill
PCB Material
CY7C65640
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