BGY288 NXP Semiconductors, BGY288 Datasheet - Page 18

• Manufacturer Part Number: BGY288
• Manufacturer: NXP Semiconductors

Specifications of BGY288

• Mounting: Surface Mount
• Pin Count: 16
• Lead Free Status / Rohs Status: Supplier Unconfirmed

Philips Semiconductors
9397 750 14011
Preliminary data sheet
12.3 Stencil design
12.4 Rework
12.5 Moisture sensitivity level
The recommended dimensions of the solder stencil are given in
on a stencil thickness of 125 m. Using a thinner or thicker stencil will require the stencil
aperture dimensions to be adjusted.
If rework is required, it is recommended that a BGA rework station with a programmable
top and bottom heater is used. The first step of the rework process is to pre-heat the
printed-circuit board with the bottom heater of the rework station. When the board has
reached the pre-heat temperature, the top heater can be used to increase the
temperature above the melting point of the solder. The component which has to be
replaced can be picked up with a vacuum nozzle. Before placing a new component the
remaining solder on the board must be removed. Fresh solder can be dispensed, a new
component placed, and the board heated as described previously.
The BGY288 is tested according to the JEDEC standard JESD 22-A113C. The BGY288 is
classified on MSL3 for a lead soldering profile with a peak temperature of 240 C, and on
MSL4 for a lead-free soldering profile with a peak temperature of 260 C.
Rev. 01 — 2 February 2005
Power amplifier with integrated control loop
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Figure 9
BGY288
and are based
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