PCF8575TS NXP Semiconductors, PCF8575TS Datasheet - Page 17

PCF8575TS

Manufacturer Part Number
PCF8575TS
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCF8575TS

Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Operating Temperature (max)
85C
Package Type
SSOP
Rad Hardened
No
Lead Free Status / Rohs Status
Compliant

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Philips Semiconductors
13 PACKAGE OUTLINE
1999 Apr 07
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
Remote 16-bit I/O expander for I
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT340-1
max.
2.0
A
24
1
Z
0.21
0.05
A
y
pin 1 index
1
1.80
1.65
A
2
IEC
0.25
A
3
e
D
0.38
0.25
b
p
MO-150AG
0.20
0.09
JEDEC
c
REFERENCES
b
D
8.4
8.0
p
0
(1)
13
12
2
E
5.4
5.2
C-bus
w
(1)
M
scale
EIAJ
0.65
2.5
17
e
c
H
7.9
7.6
E
A
2
5 mm
1.25
L
A
1
1.03
0.63
L
p
H
E
E
0.9
0.7
detail X
Q
L
PROJECTION
EUROPEAN
L
0.2
p
v
Q
(A )
0.13
w
3
A
Product specification
0.1
A
y
PCF8575
ISSUE DATE
X
v
93-09-08
95-02-04
Z
0.8
0.4
M
(1)
SOT340-1
A
8
0
o
o

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